Advanced quad flat no lead chip package having marking and corner lead features and manufacturing methods thereof
A semiconductor package and related methods are described. In one embodiment, the package includes a die pad, a first plurality of leads disposed in a lead placement area around the die pad, a second plurality of leads disposed in corner regions of the lead placement area, a semiconductor chip on the die pad and coupled to each lead, and a package body. Each lead includes an upper sloped portion and a lower sloped portion. An average of surface areas of lower surfaces of each of the second plurality of leads is at least twice as large as an average of surface areas of lower surfaces of each of the first plurality of leads. The package body substantially covers the upper sloped portions of the leads. The lower sloped portions of the leads at least partially extend outwardly from a lower surface of the package body.
1. A semiconductor package comprising:
a die pad;
a first plurality of leads circumscribing the die pad, wherein each of the first plurality of leads includes:
an upper sloped portion;
a lower sloped portion; and
a peak located between the upper sloped portion and the lower sloped portion of each of the first plurality of leads;
a second plurality of leads disposed in corner regions of the package, wherein each of the second plurality of leads includes:
an upper sloped portion;
a lower sloped portion; and
a peak located between the upper sloped portion and the lower sloped portion of each of the second plurality of leads; and
a package body;
wherein a marker lead included in the second plurality of leads has an exposed lower surface that is geometrically distinct from exposed lower surfaces of the first plurality of leads; and
wherein the marker lead has a different shape from each of the remaining ones of the second plurality of leads.
2. The semiconductor package of claim 1 , wherein:
the die pad has an upper surface and a lower surface, and includes:
an upper sloped portion disposed adjacent to the upper surface of the die pad; and
a lower sloped portion disposed adjacent to the lower surface of the die pad;
the package body substantially covers the upper sloped portion of the die pad; and
the lower sloped portion of the die pad at least partially extends outwardly from a lower surface of the package body.
3. The semiconductor package of claim 1 , wherein the die pad includes a peripheral edge region having an upper surface and defining a cavity with a cavity bottom.
4. The semiconductor package of claim 3 , wherein:
the cavity bottom includes a central portion and a recess around the central portion; and
a semiconductor chip is disposed on the central portion.
5. The semiconductor package of claim 1 , wherein the marker lead facilitates locating each of the first plurality of leads.
6. The semiconductor package of claim 1 , wherein:
the package body substantially covers the upper sloped portions of each of the first plurality of leads; and
the lower sloped portions of each of the first plurality of leads at least partially extend outwardly from a lower surface of the package body.
7. The semiconductor package of claim 1 , wherein:
the package body substantially covers the upper sloped portion of each of the second plurality of leads; and
the lower sloped portion of each of the second plurality of leads at least partially extends outwardly from a lower surface of the package body.
8. The semiconductor package of claim 1 , wherein the exposed lower surface of the marker lead has a different size from the exposed lower surfaces of each of the first plurality of leads.
9. A semiconductor package comprising:
a die pad;
a first plurality of leads circumscribing the die pad, wherein each of the first plurality of leads includes:
an upper sloped portion;
a lower sloped portion; and
a peak located between the upper sloped portion and the lower sloped portion of each of the first plurality of leads;
a second plurality of leads disposed in corner regions of the package, wherein each of the second plurality of leads includes:
an upper sloped portion;
a lower sloped portion; and
a peak located between the upper sloped portion and the lower sloped portion of each of the second plurality of leads; and
a package body;
wherein a marker lead included in the second plurality of leads has an exposed lower surface that is geometrically distinct from exposed lower surfaces of the first plurality of leads;
wherein the exposed lower surface of the marker lead has a substantially circular shape; and
wherein each of the remaining ones of the second plurality of leads has an exposed lower surface that has a substantially square shape.
10. The semiconductor package of claim 9 , wherein the die pad includes a peripheral edge region having an upper surface and defining a cavity with a cavity bottom.
11. A semiconductor package comprising:
a die pad;
a first plurality of leads disposed around the die pad, wherein each of the first plurality of leads includes:
an upper sloped portion;
a lower sloped portion; and
a peak defined by a junction of the upper sloped portion and the lower sloped portion of each of the first plurality of leads;
a second plurality of leads proximate to corners of a lead placement area, the second plurality of leads including a marker lead, the marker lead including:
a lower surface with a different shape from a lower surface of each of the remaining ones of the second plurality of leads;
an upper sloped portion; and
a lower sloped portion; and
a package body formed over the first plurality of leads and the marker lead so that the package body substantially covers the upper sloped portions of each of the first plurality of leads and the marker lead, and the lower sloped portions of each of the first plurality of leads and the marker lead at least partially extend outwardly from a lower surface of the package body.
12. The semiconductor package of claim 11 , wherein:
the lower surface of the marker lead has a substantially square shape; and
each of the remaining ones of the second plurality of leads has a lower surface that has a substantially circular shape.
13. The semiconductor package of claim 11 , wherein the lower surface of the marker lead has a width that is greater than a width of any of the lower surfaces of the first plurality of leads.
14. The semiconductor package of claim 11 , wherein each of the second plurality of leads includes:
an upper sloped portion;
a lower sloped portion; and
a peak defined by a junction of the upper sloped portion and the lower sloped portion of each of the second plurality of leads.
15. The semiconductor package of claim 11 , wherein:
the package body substantially covers the upper sloped portion of the marker lead; and
the lower sloped portion of the marker lead at least partially extends outwardly from the lower surface of the package body.
16. The semiconductor package of claim 11 , wherein the marker lead facilitates locating each of the first plurality of leads.
17. A semiconductor package comprising:
a die pad;
a plurality of leads circumscribing the die pad, wherein each of the plurality of leads includes:
an upper sloped portion;
a lower sloped portion; and
a peak located between the upper sloped portion and the lower sloped portion of each of the plurality of leads;
a plurality of contacts disposed in corner regions of the package, the plurality of contacts including a marker; and
a package body;
wherein the marker has an exposed surface that is geometrically distinct from exposed surfaces of the remaining ones of the plurality of contacts.
18. The semiconductor package of claim 17 , wherein:
the package body substantially covers an upper sloped portion of the marker; and
a lower sloped portion of the marker at least partially extends outwardly from a lower surface of the package body.
19. The semiconductor package of claim 17 , wherein:
the package body substantially covers the upper sloped portions of each of the plurality of leads; and
the lower sloped portions of each of the plurality of leads at least partially extend outwardly from a lower surface of the package body.
20. The semiconductor package of claim 17 , wherein the exposed surface of the marker has a substantially circular shape.
21. The semiconductor package of claim 17 , wherein the exposed surface of the marker has a width that is greater than a width of an exposed surface of any of the plurality of leads.
22. The semiconductor package of claim 17 , wherein the marker facilitates locating each of the plurality of leads.
23. A semiconductor package comprising:
a die pad;
a first plurality of leads circumscribing the die pad, wherein each of the first plurality of leads includes:
an upper sloped portion;
a lower sloped portion; and
a peak located between the upper sloped portion and the lower sloped portion of each of the first plurality of leads;
a second plurality of leads disposed in corner regions of the package, wherein each of the second plurality of leads includes:
an upper sloped portion;
a lower sloped portion; and
a peak located between the upper sloped portion and the lower sloped portion of each of the second plurality of leads; and
a package body;
wherein a marker lead included in the second plurality of leads has an exposed lower surface that is geometrically distinct from exposed lower surfaces of the first plurality of leads;
wherein the exposed lower surface of the marker lead has a substantially square shape; and
wherein each of the remaining ones of the second plurality of leads has an exposed lower surface that has a substantially circular shape.
24. The semiconductor package of claim 23 , wherein the die pad includes a peripheral edge region having an upper surface and defining a cavity with a cavity bottom.