Preparing data for hybrid exposure using both electron beam exposure and reticle exposure in lithographic process

1. A method for preparing data for exposure for manufacturing photo masks of a semi-conductor integrated circuit, comprising:

forming a first plurality of rectangular patterns from a reticle preparing rule;

lining an object pattern for performing reticle exposure with the first plurality of rectangular patterns, and extracting a second plurality of rectangular patterns disposed in an N×N matrix, from the first rectangular patterns in the object pattern; and

performing a violation detecting treatment and a correcting treatment of the pattern width and the pattern distance of the reticle exposure pattern on the basis of the distance between the center coordinates of the second plurality of rectangular patterns.

2. The method according to claim 1 , wherein

the correcting treatment includes removing any of the first plurality of rectangular patterns that are determined to be violation sites in the violation detecting treatment.

3. The method according to claim 2 , further comprising a step of;

integrating the second plurality of rectangular patterns after the correcting treatment to form a reticle exposure pattern.

4. The method according to claim 1 , wherein

the size and the disposing distance of the first plurality of rectangular patterns are calculated from a minimum pattern width and a minimum pattern step of the reticle forming rule.

5. The method according to claim 1 , wherein

the number N of the first plurality of rectangular patterns disposed on each side of the second rectangular patterns is calculated from a minimum pattern width and a minimum pattern step of the reticle forming rule.

6. The method according to claim 1 , wherein

the violation detecting treatment for pattern width on the basis of the distance between the center coordinates of the second plurality of rectangular patterns includes detecting whether the distance of the X-coordinate and the distance of the Y-coordinate of each center is more than a minimum pattern width determined by the reticle preparing rule on the basis of the X-Y coordinate of the centers of two of the second plurality of rectangular patterns.

7. The method according to claim 1 , wherein

the violation detecting treatment for pattern distance on the basis of the distance between the center coordinates of the second plurality of rectangular patterns includes detecting whether both the values obtained by deducting a minimum pattern width determined by the reticle preparing rule from the distance of the X-coordinate of each center, and obtained by deducting the minimum pattern width from the distance of the Y-coordinate of each center are less than a minimum pattern distance determined on the basis of the X-Y coordinate of the centers of two of the second plurality of rectangular patterns.

8. The method according to claim 1 , wherein

a plurality of rectangular patterns, one of whose side has a height equal to the height of a step, are inserted into a stair-like step of the reticle exposure pattern, and the diagonal of the rectangular pattern is extracted to be a reticle exposure pattern.

9. A method for manufacturing a photo mask comprising:

forming a first plurality of rectangular patterns from a mask preparing rule;

lining an object pattern for performing mask exposure with the first plurality of rectangular patterns, and extracting a second plurality of rectangular patterns, disposed in an N×N matrix, from the first plurality of rectangular patterns in the object pattern;

performing a violation detecting treatment and a correcting treatment of a pattern width and a pattern distance of the mask pattern on the basis of the distance between the center coordinates of the second plurality of rectangular patterns; and

placing the mask pattern, after the correcting treatment, on a mask substrate.