IP Library › Granted Patent US 8,141,514
Granted Patent B2
US 8,141,514 · App. 11/686,551 · Granted Mar 27, 2012

Plasma processing apparatus, plasma processing method, and storage medium

Assignee: Tokyo Electron Limited
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Quick Facts
Patent No.
US 8,141,514
App. No.
11/686,551
Granted
Mar 27, 2012
Kind
B2
Abstract

A plasma processing apparatus having a substrate processing chamber, which enables leakage of plasma into an exhaust space to be prevented. The substrate processing chamber has therein a processing space in which plasma processing is carried out on a substrate, an exhaust space for exhausting gas out of the processing space, and an exhaust flow path that communicates the exhaust space and the processing space together. The plasma processing apparatus further has a grounding component that is electrically grounded and is disposed in the exhaust flow path. The grounding component has a conducting portion made of a conductive material, and the conducting portion has an exposed area exposed to the exhaust flow path in a range of 100 to 1000 cm 2 .

Claims (8)

1. A plasma processing apparatus having a substrate processing chamber having therein a processing space in which plasma processing is carried out on a substrate, an exhaust space for exhausting gas out of said processing space, and an exhaust flow path that couples said exhaust space and said processing space, the plasma processing apparatus comprising:

an exhaust plate that is a plate-shaped member having a large number of vent holes therein and is disposed in said exhaust flow path; and

a grounding component that is attached to said exhaust plate and is electrically grounded, said grounding component being comprised of a member other than said exhaust plate, said grounding component lying downstream of said exhaust plate with respect to said exhaust flow path,

wherein

said grounding component includes a conducting portion made of a conductive material,

said grounding component includes an exposed area, and

the exposed area is not covered with an insulating film and exposes the conductive material of the conducting portion to said exhaust flow path,

wherein said grounding component is comprised of a ring shaped member and is attached such as to surround an opening of one vent hole in said exhaust plate, and wherein a portion of said grounding component, which faces an exhaust stream flowing out from the opening of the vent hole, corresponds to the exposed area of the grounding component.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 15, 2007
From: HONDA, MASANOBU; MATSUMOTO, NAOKI; TANAKA, SATOSHI; MATSUI, YUTAKA
To: TOKYO ELECTRON LIMITED
Reel/Frame 019017/0741 →
Priority Claims (1)
JP 2006-081351 · Mar 23, 2006 · national
Continuity (2)
Provisional Application 60789146 · Apr 5, 2006
Related Publication 20070224817A1 · Sep 27, 2007