Solder bump, semiconductor chip, method of manufacturing the semiconductor chip, conductive connection structure, and method of manufacturing the conductive connection structure
A solder bump and a conductive connection structure are provided which can conductively connect a semiconductor chip and a substrate with high connection reliability. Filler 5 is contained in a solder bump 6 and a solder joint 17 which connect a connection electrode 3 of a semiconductor chip 2 and a substrate 11 , and the filler has a larger density on the side of the connection electrode 3 than on the side of the substrate 11 in the solder joint 17 . Therefore, in the cooling solidification of solder, the shrinkage of the solder joint 17 near the connection electrode 3 of the semiconductor chip 2 is reduced by the filler 5 and the occurrence of a stress is reduced on the peripheral portion of the connection electrode 3 , thereby preventing the occurrence of cracks near the joint.
1. A solder bump provided on a connection electrode of a semiconductor chip to connect the connection electrode of the semiconductor chip and a substrate,
wherein the solder bump contains filler having a lower thermal expansion coefficient than solder of the solder bump, and the filler has a higher density on an end of the solder bump than on a base of the solder bump.
2. The solder bump according to claim 1 , wherein the filler has a porous surface.
3. The solder bump according to claim 1 , wherein the filler has a linear expansion coefficient of 0.1×10 −6 /° C. to 11×10 −6 /° C. and a specific gravity of 1.0 g/cm 3 to 6.0 g/cm 3 .
4. A semiconductor chip comprising the solder bump according to claim 1 .
5. The semiconductor chip according to claim 4 , wherein the solder bump is provided on the connection electrode of the semiconductor chip via an under bump metal, the under bump metal has a step formed thereon, and the base of the solder bump is provided so as to contain the step.
6. A method of manufacturing the semiconductor chip according to claim 4 , comprising the steps of:
forming the solder bump containing the filler on the semiconductor chip; and
melting the solder containing the filler,
wherein in the melting step, the semiconductor chip is vibrated to segregate the filler in the solder bump in a state in which the solder bump is disposed on the semiconductor chip.
7. A conductive connection structure comprising a solder joint formed by joining a solder bump provided on a connection electrode of a semiconductor chip and a solder portion provided on a substrate, the semiconductor chip being mounted on the substrate via the solder joint,
wherein the solder joint contains filler having a lower thermal expansion coefficient than solder of the solder joint, and the filler has a larger density on a side of the connection electrode than on a side of the substrate in the solder joint.
8. The conductive connection structure according to claim 7 , wherein the density of the filler is a volume ratio of 20% to 50% on the side of the connection electrode in the solder joint.
9. The conductive connection structure according to claim 7 , wherein the density of the filler is a volume ratio of 35% to 50% on the side of the connection electrode in the solder joint.
10. The conductive connection structure according to claim 7 , wherein the filler has a porous surface.
11. The conductive connection structure according to claim 7 , wherein the filler has a linear expansion coefficient of 0.1×10 −6 /° C. to 11×10 −6 /° C. and a specific gravity of 1.0 g/cm 3 to 6.0 g/cm 3 .
12. The conductive connection structure according to claim 7 , wherein the solder joint is connected to the connection electrode of the semiconductor chip via an under bump metal, the under bump metal has a step formed thereon, and the solder joint has a portion connected to the under bump metal so as to contain the step.
13. A method of manufacturing the conductive connection structure according to claim 7 , comprising the steps of:
placing the semiconductor chip in contact with a predetermined position of the substrate; and
melting the solder bump of the semiconductor chip,
wherein in the melting step, one of the substrate and the semiconductor chip is vibrated in a state in which the semiconductor chip is disposed on the substrate, so that the filler is segregated in the solder bump to form the solder joint.