Integrated circuit assembly with passive integration substrate for power and ground line routing on top of an integrated circuit chip
An integrated circuit assembly (ICA) comprises: a digital and/or analog integrated circuit (S 1 ) having a core with input and/or output pins and at least one power supply connection pad (PP) and one ground connection pad (GP) connected to a chosen one of the input and/or output pins and respectively connected to power supply and ground connection zones (MZ 1 ) of a printed circuit board (PCB), and a passive integration substrate (S 2 ) set on top of the digital and/or analog integrated circuit (S 1 ) and comprising i) at least first and second input zones respectively connected to the ground (GP) and power supply (PP) connection pads to be fed with input ground and supply voltages, ii) input and/or output zones connected to chosen core input and/or output pins, and Ëi) a passive integrated circuit (PIC) connected to the first and second input zones and arranged to feed the substrate input and/or output zones with chosen ground and supply voltages defined from the input ground and supply voltages.
1. Integrated circuit assembly (ICA), comprising:
a digital and/or analog integrated circuit, comprising:
a core;
input and/or output pins coupled to the core;
at least one power supply connection pad and one ground connection pad connected to one of said input and/or output pins and respectively connected to a power supply connection zone and a ground connection zone of a printed circuit board (PCB);
a passive integration substrate arranged in a flipped position on said digital and/or analog integrated circuit, comprising:
first and second input zones respectively connected to said ground and power supply connection pads;
input and/or output zones connected to core input and/or output pins; and
a passive integrated circuit connected to said first and second input zones and configured to provide said substrate input and/or output zones with ground and supply voltages; and
an intermediate substrate wherein the digital and/or analog integrated circuit is arranged on an intermediate substrate, wherein the intermediate substrate comprises:
first intermediate connection zones connected to said power supply and ground connection pads and second intermediate connection zones connected to said first intermediate connection zones through vias and to said power supply and ground connection zones through conducting balls.
2. The integrated circuit assembly of claim 1 , wherein said passive integrated circuit further comprises at least one capacitor means.
3. The integrated circuit assembly of claim 2 , wherein said capacitor means are planar structures with a high dielectric constant.
4. The integrated circuit assembly of claim 2 , wherein said capacitor means comprises pores or trenches coated with a dielectric material and connected to electrodes.
5. The integrated circuit assembly of claim 1 , wherein said passive integrated circuit further comprises:
a first circuit dedicated to the definition of each chosen ground voltage;
a second circuit dedicated to the definition of each chosen supply voltage; and
a decoupling capacitor means connecting said first circuit to said second circuit in order to decouple different supply voltages.
6. The integrated circuit assembly of claim 5 , wherein said decoupling capacitor means comprises pores or trenches coated with a dielectric material and connected to electrodes.
7. The integrated circuit assembly to of claim 5 , wherein said decoupling capacitor means comprises planar structures with a high dielectric constant.
8. The integrated circuit assembly of claim 1 , wherein said passive integrated circuit further comprises at least one floating capacitor means connected between the two input and/or output zones.
9. The integrated circuit assembly of claim 8 , wherein said floating capacitor means comprises pores or trenches coated with a dielectric material and connected to electrodes.
10. The integrated circuit assembly of claim 8 , wherein said floating capacitor means comprises planar structures with a high dielectric constant.
11. The integrated circuit assembly of claim 1 , wherein said passive integration substrate comprises at least one of semi-insulating material or a semiconductor material.
12. The integrated circuit assembly of claim 11 , wherein said passive integration substrate comprises silicon.
13. The integrated circuit assembly of claim 1 , wherein said digital and/or analog integrated circuit comprises micro pads respectively connected to said chosen core input and/or output pins and to said ground and power supply connection pads; and
conducting micro-balls inserted between said digital and/or analog integrated circuit and said passive integration substrate and connecting said first and second input zones and said input and/or output zones respectively to the corresponding micro pads.
14. The integrated circuit assembly of claim 1 , wherein said printed circuit board, comprises:
first main connection zones defining at least said power supply and ground connection zones and second main connection zones connected to said first main connection zones through vias, said first main connection zones being respectively connected at least to said power supply connection pad and ground connection pad of said digital and/or analog integrated circuit through conducting balls.