Nanomesh SRAM cell

1. A method for fabricating a SRAM cell, comprising the steps of:

forming at least one pair of pass gates by forming, for each pass gate, one or more device layers on a wafer, each pass gate device layer including a source region, a drain region and a plurality of nanowire channels connecting the source region and the drain region, and forming a gate common to each of the pass gate device layers surrounding the nanowire channels, wherein the nanowire channels are formed by forming an alternating series of silicon and sacrificial layers in a stack on the wafer, wherein one or more of the sacrificial layers comprise at least one n-type dopant and one or more other of the sacrificial layers comprise at least one p-type dopant;

forming nanowire hardmasks over the silicon and sacrificial layers in regions of the cell in which the pass gates and at least one pair of inverters are to be formed, wherein the nanowire hardmasks comprise a dual hardmask structure having an oxide portion and a nitride portion over the oxide portion;

forming the at least one pair of inverters by forming, for each inverter, a plurality of device layers adjacent to the pass gate device layers on the wafer, each inverter device layer including a source region, a drain region and a plurality of nanowire channels connecting the source region and the drain region, and forming a gate common to each of the inverter device layers surrounding the nanowire channels;

introducing at least one n-type dopant into the source and drain regions of one or more of the pass gate device layers;

introducing at least one n-type dopant into the source and drain regions of one or more of the inverter device layers; and

introducing at least one p-type dopant into the source and drain regions of one or more other of the inverter device layers.

2. The method of claim 1 , wherein the SRAM cell comprises one pair of pass gates and one pair of inverters formed on the wafer, the method further comprising the step of:

performing the steps of forming the pair of pass gates and forming the pair of inverters such that the pair of inverters are located in between the pair of pass gates.

3. The method of claim 1 , further comprising the step of:

forming an electrically insulating layer separating the one or more sacrificial layers comprising the at least one n-type dopant from the one or more other of the sacrificial layers comprising the at least one p-type dopant, such that the one or more sacrificial layers comprising the at least one n-type dopant are below the electrically insulating layer and the one or more other of the sacrificial layers comprising the at least one p-type dopant are above the electrically insulating layer.

4. The method of claim 3 , further comprising the step of:

selectively removing portions of the electrically insulating layer and portions of the silicon layers and sacrificial layers comprising the at least one p-type dopant above the electrically insulating layer in regions of the cell in which the pass gates are to be formed.

5. The method of claim 3 , further comprising the steps of:

diffusing the n-type dopant from the one or more sacrificial layers below the electrically insulating layer throughout one or more of the silicon layers below the electrically insulating layer; and

diffusing the p-type dopant from the one or more sacrificial layers above the electrically insulating layer throughout one or more of the silicon layers above the electrically insulating layer.