Process for the production of packaging material for electronic component cases

1. A production method of a packaging material for electronic component cases, the production method comprising:

a temporary bonding which temporarily bonds a first sheet comprising a thermoplastic resin non-oriented film layer and a thermoplastic adhesive resin layer laminated on one surface of the thermoplastic resin non-oriented film layer and a second sheet comprising a heat resistant resin oriented film layer and an aluminum foil layer laminated on one surface of the heat resistant resin oriented film layer by passing the first sheet and the second sheet between a pair of rolls in a state in which the thermoplastic adhesive resin layer and the aluminum foil layer are brought into contact with each other to press the thermoplastic adhesive resin layer and the aluminum foil layer while heating in a state in which the thermoplastic adhesive resin does not melt to thereby obtain a pre-laminated sheet; and

a complete bonding which integrally bonds the first sheet and the second sheet by heating the pre-laminated sheet to melt the thermoplastic adhesive resin,

wherein at the temporary bonding, a pre-bonded sheet obtained by pressing the first sheet and the second sheet with the pair of rolls is cooled by bringing into contact with a cooling roll to obtain the pre-laminated sheet, and at the complete bonding, an integrally bonded sheet obtained by integrally bonding the first sheet and the second sheet is cooled by bringing into contact with a cooling roll.

2. The production method of a packaging material for electronic component cases as recited in claim 1 , wherein at the temporary bonding, the first sheet and the second sheet are passed between the pair of rolls comprising a rubber roll and a heating roll.

3. The production method of a packaging material for electronic component cases as recited in claim 1 , wherein the temporary bonding satisfies:

( M− 60)≦ T ≦( M− 5),

where M is a melting point of the thermoplastic adhesive resin and T is a temperature of the thermoplastic adhesive resin at a time of pressing.

4. The production method of a packaging material for electronic component cases as recited in claim 2 , wherein the temporary bonding and the complete bonding satisfy:

( X− 80)≦ Y ≦( X− 10),

where X is a temperature of the heating roll, and Y is a temperature of the cooling roll.

5. The production method of a packaging material for electronic component cases as recited in claim 2 , wherein the temporary bonding and the complete bonding satisfy:

1.01W≦Z≦1.30W,

where W is a circumferential direction traveling speed of an external peripheral surface of the heating roll, and Z is a circumferential direction traveling speed of an external peripheral surface of the cooling roll.

6. The production method of a packaging material for electronic component cases as recited in claim 1 , wherein the thermoplastic resin non-oriented film is at least one non-oriented film made of a thermoplastic resin selected from the group consisting of polyethylene, polypropylene, olefin series copolymer, acid modification thereof and ionomer, and wherein the heat resistant resin oriented film is an oriented film made of polyamide or polyester.