Leadframe structure for electronic packages
A leadframe structure for an electronic package is provided, wherein the leadframe structure comprises a die-pad, a barrier area, and a bonding area, wherein the barrier area is arranged between the die-pad and the bonding area, and wherein the barrier area is adapted to electrically connect the die-pad and the bonding area, and is further constructed in such a way that delamination growth between the leadframe structure and a moulding compound fixable to the leadframe structure is reduced.
1. A leadframe structure for an electronic package, the leadframe structure comprising:
a die-pad configured and arranged for die attachment,
a bonding area and
a barrier area having a barrier structure connecting the die-pad and the bonding area and configured and arranged with a length and width, at a connection between the barrier and the die-pad, that mitigates the delamination of a moulding compound from the barrier as the moulding compound delaminates from a portion of the die-pad adjacent the connection between the barrier and the die pad.
2. The leadframe structure according to claim 1 ,
wherein the barrier area is formed by a barrier structure having a length which is at least two times the width of the barrier structure.
3. The leadframe structure according to claim 1 ,
wherein the bonding area includes a fused lead.
4. The leadframe structure according to claim 3 ,
wherein the fused lead includes a dummy fused lead.
5. The leadframe structure according to claim 1 , further comprising:
a clamping area configured and arranged for clamping during a bonding step.
6. An electronic package, comprising:
a leadframe structure according to claim 1 , and
a die wherein the die is attached to the die-pad, and
wherein the die is further electrically contacted to the bonding area.
7. The electronic package according to claim 6 , further comprising:
wherein the moulding compound at least partially covers the leadframe structure and the die.
8. The leadframe structure of claim 1 , wherein the barrier structure is configured and arranged to prevent a delaminated portion of the moulding compound on the die-pad adjacent the barrier structure from further delaminating a portion of the moulding compound on the barrier adjacent the die-pad.
9. A leadframe structure for an electronic package, the leadframe structure comprising:
a die-pad;
a bonding area spaced apart from the die-pad and configured and arranged for connecting to the die-pad via a bondwire; and
a barrier connecting the die-pad and the bonding area and configured and arranged to, at the connection to the die-pad, mitigate thermomechanical stress at the barrier, relative to thermomechanical stress that causes delamination of the moulding compound from the die-pad immediately adjacent the barrier.
10. The leadframe structure of claim 9 , wherein the barrier is configured and arranged to prevent a delaminated portion of the moulding compound on the die-pad adjacent the barrier structure from further delaminating a portion of the moulding compound on the barrier adjacent the die-pad.
11. The leadframe structure according to claim 9 , wherein the barrier is configured and arranged with length and width that mitigate thermomechanical stress at the barrier, the width being less than half a width of the bonding area at a connection between the bonding area and the barrier, and the length being at least four times the width of the barrier.
12. The leadframe structure according to claim 9 , wherein the barrier, the die-pad, and the bonding area are formed of the same type of material.
13. The leadframe structure according to claim 9 , further including a clamping area arranged around the die-pad and configured to support leads during wire bonding to the bonding area.
14. An apparatus comprising:
a leadframe structure including a die-pad, a bonding pad spaced apart from the die-pad, and a barrier connected between the die-pad and the bonding pad
a die secured to the die-pad and connected to the bonding pad via at least one bondwire;
a moulding compound encapsulating the die, the at least one bonding wire and the leadframe structure, the moulding compound being configured and arranged to support the bond wire in response to removal of the leadframe structure;
the barrier having a barrier structure connected to the die-pad, the barrier structure having a length and width at a connection of the barrier to the die-pad that is configured and arranged to mitigate the growth of delamination of the moulding compound from the die-pad adjacent the barrier structure to the barrier.
15. The apparatus of claim 14 , wherein the barrier structure is configured and arranged to prevent a delaminated portion of the moulding compound on the die-pad adjacent the barrier structure from further delaminating a portion of the moulding compound on the barrier adjacent the die-pad.
16. The apparatus of claim 14 , wherein the barrier structure has a length that is at least four times a width of the barrier structure, the width being less half a width of the bonding pad.
17. The apparatus according to claim 14 , wherein the barrier structure, the die-pad and the bonding pad are formed from a metallic conductor.
18. The apparatus according to claim 14 , further including a clamping structure arranged around the die-pad and configured to support leads during wire bonding to the bonding area.
19. The apparatus according to claim 14 , wherein the barrier structure is configured and arranged to, at the connection to the die-pad, mitigate delamination of a moulding compound from the barrier, relative to delamination of the moulding compound from the die-pad immediately adjacent the barrier.