Method of manufacturing a wiring substrate

1. A method of manufacturing a wiring substrate comprising:

forming a conducting layer on a first insulating layer including a plurality of first glass fiber bundles;

forming a photosensitive resist layer on the conducting layer;

recognizing a first origin position on the first insulating layer;

forming a mask on the resist layer by positioning the mask with respect to the first origin position, the mask being formed so as to position wiring patterns only on positions overlapping the first glass fiber bundles in a planar view; and

exposing the resist layer via the mask and forming the wiring patterns only on the positions overlapping the first glass fiber bundles in the planar view.

2. The method according to claim 1 , further comprising:

laminating a second insulating layer including a plurality of second glass fiber bundles so as to cover the wiring patterns on the first insulating layer, wherein

said laminating the second insulating layer includes recognizing the first origin position on the first insulating layer and a second origin position on the second insulating layer, and laminating the second insulating layer on the first insulating layer such that the second origin position of the second insulating layer coincides with the first origin position of the first insulating layer, and

said exposing the resist layer and forming the wiring patterns includes forming the wiring patterns only on the positions overlapping both the first glass fiber bundles included in the first insulating layer and the second glass fiber bundles included in the second insulating layer.

3. The method according to claim 1 , wherein

said recognizing the first origin position includes recognizing the first origin position by radiating an X-ray onto the first insulating layer.

4. The method according to claim 2 , wherein

said laminating the second insulating layer includes recognizing the first origin position and the second origin position by radiating an X-ray onto the first insulating layer and the second insulating layer.

5. The method according to claim 1 , further comprising:

measuring coordinates of a position of the first glass fiber bundles with respect to the first origin position in the first insulating layer and recognizing a region of the first glass fiber bundles based on the coordinates, said measuring the coordinates being performed before said forming the conducting layer; and

acquiring design information relevant to the positions where the wiring patterns are positioned with respect to the first origin position; and

determining whether it is possible to form the wiring patterns only on the positions overlapping the first glass fiber bundles in the planar view, based on the region of the first glass fiber bundles recognized in said measuring the coordinates and the design information acquired in said acquiring the design information relevant to the positions where the wiring patterns are positioned.

6. The method according to claim 5 , wherein

said measuring the coordinates includes recognizing the region of the first glass fiber bundles by performing image recognition of the first glass fiber bundles by radiating X-rays onto the first insulating layer and measuring coordinates of all intersection points in the first glass fiber bundles.

7. The method according to claim 5 , wherein

said determining whether it is possible to form the wiring patterns only on the positions overlapping the first glass fiber bundles in the planar view includes correcting a part of the design information such that the wiring patterns are formed only on the positions overlapping the first glass fiber bundles in the planar view and fabricating the mask used in said forming the mask on the resist layer and said exposing the resist layer and forming the wiring patterns based on the corrected design information, when it is determined that it is not possible to form the wiring patterns only on the positions overlapping the first glass fiber bundles in the planar view.

8. The method according to claim 5 , wherein

said forming a conducting layer, said forming the photosensitive resist layer, said recognizing the first origin position, said forming the mask on the resist layer, and said exposing the resist layer and forming the wiring patterns are performed when it is determined that it is possible to form the wiring patterns only on the positions overlapping the first glass fiber bundles in the planar view.

9. The method according to claim 5 , further comprising:

determining whether it is possible to form the wiring patterns only on the positions overlapping the first glass fiber bundles in the planar view by moving the parallel wiring patterns without changing a pitch between the parallel wiring patterns, the determination being made based on the region of the first glass fiber bundles recognized in said measuring the coordinates and the design information acquired in said acquiring the design information relevant to the positions where the wiring patterns are positioned,

said determining whether it is possible to form the wiring patterns only on the positions overlapping the first glass fiber bundles in the planar view by moving the parallel wiring patterns without changing the pitch between the parallel wiring patterns being performed when the wiring patterns include parallel wiring patterns that are used for transmitting differential signals and when it is determined that it is not possible to form the wiring patterns only on the positions overlapping the first glass fiber bundles in the planar view.

10. The method according to claim 9 , wherein

said determining whether it is possible to form the wiring patterns only on the positions overlapping the first glass fiber bundles in the planar view includes correcting a part of the design information to change the pitch between the parallel wiring patterns such that the wiring patterns are formed only on the positions overlapping the first glass fiber bundles in the planar view, and fabricating, based on the corrected design information, the mask used in said forming the mask on the resist layer and said exposing the resist layer and forming the wiring patterns, when it is determined that it is not possible to form the wiring patterns only on the positions overlapping the first glass fiber bundles in the planar view without changing the pitch between the parallel wiring patterns.

11. The method according to claim 9 , wherein

said determining whether it is possible to form the wiring patterns only on the positions overlapping the first glass fiber bundles in the planar view includes correcting a part of the design information without changing the pitch between the parallel wiring patterns such that the wiring patterns are formed only on the positions overlapping the first glass fiber bundles in the planar view, and fabricating, based on the corrected design information, the mask used in said forming the mask on the resist layer and said exposing the resist layer and forming the wiring patterns, when it is determined that it is possible to form the wiring patterns only on the positions overlapping the first glass fiber bundles in the planar view without changing the pitch between the parallel wiring patterns.

12. The method according to claim 10 , wherein

the pitch is changed within an allowable range that is set in advance, and by a minimum amount.