Chip having a bump and package having the same
The present invention relates to a chip having a bump and a package having the same. The chip includes a chip body, at least one via, a passivation layer, an under ball metal layer and at least one bump. The via penetrates the chip body, and is exposed to a surface of the chip body. The passivation layer is disposed on the surface of the chip body, and the passivation layer has at least one opening. The opening exposes the via. The under ball metal layer is disposed in the opening of the passivation layer, and is connected to the via. The bump is disposed on the under ball metal layer, and includes a first metal layer, a second metal layer and a third metal layer. The first metal layer is disposed on the under ball metal layer. The second metal layer is disposed on the first metal layer. The third metal layer is disposed on the second metal layer. As the bumps can connect two chips, the chip is stackable, and so the density of the product is increased while the size of the product is reduced.
1. A chip having a bump, comprising:
a chip body, having a surface;
at least one via, penetrating the chip body and exposed to the surface of the chip body, wherein the distance between the central axes of two adjacent vias is defined as a pitch;
a passivation layer, disposed on the surface of the chip body, wherein the passivation layer has at least one opening, and the opening exposes the via;
an under ball metal layer (UBM), disposed in the opening of the passivation layer, and connected to the via; and
at least one bump, disposed on the under ball metal layer, wherein the diameter of the bump is smaller than or equals to two-thirds of the pitch, and the bump comprises:
a first metal layer, disposed on the under ball metal layer, wherein the material of the first metal layer is copper (Cu);
a second metal layer, disposed on the first metal layer, wherein the material of the second metal layer is nickel (Ni); and
a third metal layer, disposed on the second metal layer, wherein the material of the third metal layer is tin (Sn), tin-silver alloy or gold (Au).
2. The chip as claimed in claim 1 , wherein the material of the under ball metal layer is titanium-copper (TiCu) alloy.
3. The chip as claimed in claim 1 , wherein the thickness of the first metal layer is 7 μm, the thickness of the second metal layer is 3 μm, and the thickness of the third metal layer is 2 μm
4. The chip as claimed in claim 1 , wherein the thickness of the first metal layer is 7 μm, the thickness of the second metal layer is 3 μm, and the thickness of the third metal layer is 0.5 μm.
5. The chip as claimed in claim 1 , further comprising a fourth metal layer disposed between the second metal layer and the third metal layer.
6. The chip as claimed in claim 5 , wherein the material of the fourth metal layer is the same as that of the first metal layer.
7. The chip as claimed in claim 5 , wherein the material of the first metal layer is copper (Cu), the material of the second metal layer is nickel (Ni), the material of the fourth metal layer is tin (Sn) or tin-silver alloy, and the material of the third metal layer is gold (Au).
8. The chip as claimed in claim 5 , wherein the thickness of the first metal layer is 7 μm, the thickness of the second metal layer is 3 μm, the thickness of the fourth metal layer is greater than 7 μm, and the thickness of the third metal layer is 3-5 μm.
9. The chip as claimed in claim 5 , wherein the thickness of the first metal layer is 7 μm, the thickness of the second metal layer is 3 μm, the thickness of the fourth metal layer is greater than 3-4 μm, and the thickness of the third metal layer is 0.5 μm.
10. A chip having a bump, comprising:
a chip body, having a surface;
at least one via, penetrating the chip body and exposed to the surface of the chip body, wherein the distance between the central axes of two adjacent vias is defined as a pitch;
a passivation layer, disposed on the surface of the chip body, wherein the passivation layer has at least one opening, and the opening exposes the via;
an under ball metal layer (UBM), disposed in the opening of the passivation layer, and connected to the via; and
at least one bump, disposed on the under ball metal layer, wherein the diameter of the bump is smaller than or equals to two-thirds of the pitch, and the bump comprises:
a first metal layer, disposed on the under ball metal layer;
a second metal layer, disposed on the first metal layer;
a third metal layer, disposed on the second metal layer; and
a fourth metal layer disposed between the second metal layer and the third metal layer, wherein the material of the fourth metal layer is the same as that of the first metal layer.
11. The chip as claimed in claim 10 , wherein the material of the under ball metal layer is titanium-copper (TiCu) alloy.
12. The chip as claimed in claim 10 , wherein the thickness of the first metal layer is 7 μm, the thickness of the second metal layer is 3 μm, and the thickness of the third metal layer is 2 μm.
13. The chip as claimed in claim 10 , wherein the material of the first metal layer and the fourth metal layer is copper (Cu), the material of the second metal layer is nickel (Ni), and the material of the third metal layer is tin (Sn) or tin-silver alloy.
14. The chip as claimed in claim 10 , wherein the thickness of the first metal layer is 7 μm, the thickness of the second metal layer is 3 μm, the thickness of the fourth metal layer is greater than 7 μm, and the thickness of the third metal layer is 3-5 μm.
15. The chip as claimed in claim 10 , wherein the thickness of the first metal layer is 7 μm, the thickness of the second metal layer is 3 μm, the thickness of the fourth metal layer is greater than 3-4 μm, and the thickness of the third metal layer is 0.5 μm.
16. A chip having a bump, comprising:
a chip body, having a surface;
at least one via, penetrating the chip body and exposed to the surface of the chip body, wherein the distance between the central axes of two adjacent vias is defined as a pitch;
a passivation layer, disposed on the surface of the chip body, wherein the passivation layer has at least one opening, and the opening exposes the via;
an under ball metal layer (UBM), disposed in the opening of the passivation layer, and connected to the via; and
at least one bump, disposed on the under ball metal layer, wherein the diameter of the bump is smaller than or equals to two-thirds of the pitch, and the bump comprises:
a first metal layer, disposed on the under ball metal layer, wherein the material of the first metal layer is copper (Cu);
a second metal layer, disposed on the first metal layer, wherein the material of the second metal layer is nickel (Ni)
a third metal layer, disposed on the second metal layer, wherein the material of the third metal layer is gold (Au); and
a fourth metal layer disposed between the second metal layer and the third metal layer, wherein the material of the fourth metal layer is tin (Sn) or tin-silver alloy.
17. The chip as claimed in claim 16 , wherein the material of the under ball metal layer is titanium-copper (TiCu) alloy.
18. The chip as claimed in claim 16 , wherein the thickness of the first metal layer is 7μm, the thickness of the second metal layer is 3 μm, and the thickness of the third metal layer is 2μm.
19. The chip as claimed in claim 16 , wherein the thickness of the first metal layer is 7μm, the thickness of the second metal layer is 3 μm, the thickness of the fourth metal layer is greater than 7 μm, and the thickness of the third metal layer is 3-5 μm.
20. The chip as claimed in claim 16 , wherein the thickness of the first metal layer is 7μm, the thickness of the second metal layer is 3 μm, the thickness of the fourth metal layer is greater than 3-4 μm, and the thickness of the third metal layer is 0.5 μm.