Apparatus and method for improving photoresist properties using a quasi-neutral beam
The invention can provide apparatus and methods of processing a substrate in real-time using a Quasi-Neutral Beam (Q-NB) curing system to improve the etch resistance of photoresist layer. In addition, the improved photoresist layer can be used to more accurately control gate and/or spacer critical dimensions (CDs), to control gate and/or spacer CD uniformity, and to eliminate line edge roughness (LER) and line width roughness (LWR).
1. A method for curing a deposited layer on a substrate using a Quasi-Neutral Beam (Q-NB) curing system, comprising:
positioning the substrate on a substrate holder in a curing chamber in the Q-NB curing system, wherein the curing chamber is configured to cure, freeze, and/or harden an un-patterned and/or a patterned masking layer on the substrate using a curing plasma;
creating a first plasma at a first plasma potential using a first process gas in a first plasma region, the first plasma region being located in a plasma generation chamber, wherein a plasma generation system is coupled to the plasma generation chamber and provides a first RF power when the first plasma is formed;
creating the curing plasma in the curing chamber at a curing plasma potential using electron flux from the first plasma region, wherein the electron flux from the first plasma in the first plasma region passes from the plasma generation chamber through a separation member to the curing chamber thereby creating the curing plasma;
elevating the curing plasma potential above the first plasma potential to control the electron flux;
maintaining the curing plasma during a first Q-NB curing procedure, wherein pressure in the curing chamber is controlled by pumping the curing chamber and flowing a second process gas into the curing chamber; and
exposing the deposited layer on the substrate to the curing plasma during the first Q-NB curing procedure.
2. A method for operating a Quasi-Neutral Beam (Q-NB) curing system, comprising:
positioning a substrate on a substrate holder in a curing chamber in the Q-NB curing system;
creating a quasi-neutral beam in the curing chamber in the Q-NB curing system, wherein the curing chamber is configured to cure, freeze, and/or harden a deposited masking layer on the substrate using the quasi-neutral beam;
exposing the deposited masking layer on the substrate to the quasi-neutral beam during a first quasi-neutral beam curing procedure;
determining a curing state for the substrate;
performing at least one etching procedure when the curing state is equal to a first value; and
performing at least one corrective action when the curing state is not equal to the first value.