Resin molding device
A resin molding device includes a lead plate and a first resin molding member. The lead plate includes patterns. Each of the patterns includes a base, a plurality of lead pairs; and a lead connection portion. Each of the lead pairs includes a first lead and a second lead. The first resin molding member is integrally formed with the base and the lead pairs. The first resin molding member defines a recessed portion at a mounting side surface on the base where a light emitting device is to be mounted. The recessed portion is formed to open upwardly and to have a side surface. The lead pairs are partially exposed at a bottom surface area of the recessed portion. The first lead or the second lead is capable of mounting a protection device thereon such that the protection device is covered by the first resin molding member.
1. A resin molding device comprising:
a lead plate; and
a first resin molding member which is integrally coupled with the lead plate,
wherein the lead plate comprises a plurality of patterns that are arranged in a matrix shape in the lead plate, each of the patterns comprising:
a base capable of mounting a light emitting device thereon;
a plurality of lead pairs, each of which comprises a first lead and a second lead, each of which is capable of electrically connecting with the light emitting device, the lead pairs being provided at each side of the base opposing and spaced away from the base, respectively; and
a lead connection portion extending from the lead pairs to connect the lead pairs with the base,
wherein the first resin molding member is integrally formed with the base and the lead pairs, with at least a part of the base and the lead pairs being covered with a thermosetting resin material,
wherein the first resin molding member defines a recessed portion at a mounting side surface on the base where the light emitting device is to be mounted, and the recessed portion is formed to open upwardly and to have a side surface,
wherein the lead pairs are partially exposed at a bottom surface area of the recessed portion, and
wherein the first lead or the second lead is capable of mounting a protection device thereon such that the protection device is covered by the first resin molding member.
2. The resin molding device according to claim 1 , wherein the plurality of lead pairs are substantially symmetrically arranged at opposing side of the base.
3. The resin molding device according to claim 1 , wherein the base is at least partially exposed at a back surface which is opposite to the mounting side surface.
4. The resin molding device according to claim 2 , wherein the base is at least partially exposed at a back surface which is opposite to the mounting side surface.