IP Library › Granted Patent US 8,345,494
Granted Patent B2
US 8,345,494 · App. 13/275,757 · Granted Jan 1, 2013

Semiconductor memory device

Assignee: Hynix Semiconductor Inc.
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Quick Facts
Patent No.
US 8,345,494
App. No.
13/275,757
Granted
Jan 1, 2013
Kind
B2
Abstract

A semiconductor memory device includes a plurality of memory cell mats each comprising a plurality of normal memory cell arrays; and a redundancy memory cell array configured to replace a defective memory cell with a plurality of redundancy memory cells corresponding to a redundancy word line when the redundancy word line corresponding to one or more redundancy memory cell arrays is activated in response to an address corresponding to the defective memory cell among the plurality of normal memory cell arrays.

Claims (14)

1. A semiconductor memory device, comprising:

a normal word line coupled to a plurality of normal memory cells;

a first redundancy word line coupled to a plurality of first redundancy memory cells, configured to replace a defective memory cell with the plurality of first redundancy memory cells; and

a second redundancy word line coupled to a plurality of second redundancy memory cells, configured to replace the defective memory cell with the plurality of second redundancy memory cells,

wherein the first and second redundancy word lines are simultaneously activated in response to an address corresponding to the defective memory cell.

2. The semiconductor memory device of claim 1 , further comprising a word line driving unit configured to activate the first and second redundancy word lines in response to the address corresponding to the defective memory cell.

3. A semiconductor memory device, comprising:

a plurality of normal memory cell arrays;

a first redundancy memory cell array configured to replace a defective memory cell with a plurality of first redundancy memory cells; and

a second redundancy memory cell array configured to replace the defective memory cell with a plurality of second redundancy memory cells,

wherein the first and second redundancy memory cell arrays are simultaneously activated in response to an address corresponding to the defective memory cell.

4. The semiconductor memory device of claim 3 , further comprising:

a word line driving unit configured to activate a redundancy word line coupled to the first and second redundancy memory cell arrays in response to the address corresponding to the defective memory cell.

5. The semiconductor memory device of claim 3 , wherein the plurality of normal memory cell arrays are configured to have an open bit line architecture.

Priority Claims (1)
KR 10-2009-0041593 · May 13, 2009 · national
Continuity (2)
Continuation 12490881 · Jun 24, 2009
Related Publication 20120033515A1 · Feb 9, 2012