Method of packaging compound semiconductor substrates
Affords a compound semiconductor substrate packaging method for preventing oxidation of the surface of compound semiconductor substrates. The compound semiconductor substrate packaging method provides: a first step of inserting a compound semiconductor substrate ( 10 ) into a gas-permeable, rigid container ( 20 ), placing the rigid container ( 20 ) into an inner-packing pouch ( 30 ) having an oxygen transmission rate of 1 to 100 ml·m −2 ·day −1 ·atm −1 , and a moisture transmission rate of 1 to 15 g·m −2 ·day −1 , replacing the air inside the inner-packing pouch ( 30 ) with an inert gas, and hermetically sealing the inner-packing pouch; and a second step of placing the sealed inner-packing pouch ( 30 ), and a deoxygenating/dehydrating agent ( 40 ) that at least either absorbs or adsorbs oxygen gas and moisture, into an outer-packing pouch ( 60 ) that has an oxygen transmission rate that is 5 ml·m −2 ·day −1 ·atm −1 or less and is lower than that of the inner-packing pouch ( 30 ), and a moisture transmission rate that is 3 g·m −2 ·day −1 or less and is lower than that of the inner-packing pouch ( 30 ), and hermetically sealing the outer-packing pouch ( 60 ).
1. A compound semiconductor substrate packaging method comprising:
a first step of inserting a compound semiconductor substrate into a gas-permeable, rigid container, placing the rigid container into a heat-sealable inner-packing pouch having an oxygen transmission rate of 1 to 100 ml·m −2 ·day −1 ·atm −1 , and a moisture transmission rate of 1 to 15 g·m −2 ·day −1 , replacing the air inside the inner-packing pouch with an inert gas, and heat-sealing the inner-packing pouch containing the inert gas to thereby hermetically seal the inert gas into the pouch; and
a second step of placing the sealed inner-packing pouch, and a deoxygenating/dehydrating agent that absorbs or adsorbs at least either oxygen gas or moisture, into an outer-packing pouch that has an oxygen transmission rate that is 5 ml·m −2 ·day −1 ·atm −1 or less and is lower than that of the inner-packing pouch, and a moisture transmission rate that is 3 g·m −2 ·day −1 or less and is lower than that of the inner-packing pouch, and hermetically sealing the outer-packing pouch.
2. A compound semiconductor substrate packaging method as set forth in claim 1 , wherein in said first step, the operation of replacing the air inside the inner-packing pouch with an inert gas is carried out by means of an operation in which a vacuum is drawn on the inner-packing pouch by exhausting the air inside, after which an inert gas is flowed into the inner-packing pouch.
3. A compound semiconductor substrate packaging method as set forth in claim 2 , wherein in said first step, the pressure of the air inside the inner-packing pouch after a vacuum is drawn on the inner-packing pouch by exhausting the air inside, and prior to the inert gas being flowed into the inner-packing pouch, is 15 torr or less.
4. A compound semiconductor substrate packaging method as set forth in claim 3 , wherein:
the outer-packing pouch is transparent; and
in said second step, an oxygen/moisture indicator for indicating the concentration of at least either oxygen gas or moisture is also placed into the outer-packing pouch.
5. A compound semiconductor substrate packaging method as set forth in claim 2 , wherein:
the outer-packing pouch is transparent; and
in said second step, an oxygen/moisture indicator for indicating the concentration of at least either oxygen gas or moisture is also placed into the outer-packing pouch.
6. A compound semiconductor substrate packaging method as set forth in claim 1 , wherein:
the outer-packing pouch is transparent; and
in said second step, an oxygen/moisture indicator for indicating the concentration of at least either oxygen gas or moisture is also placed into the outer-packing pouch.
7. A compound semiconductor substrate packaging method as set forth in claim 1 , wherein the inner-packing pouch is composed substantially of a plastic material or materials, and in said first step the heat-sealing of the inner pouch is by thermoplastic welding.
8. A compound semiconductor substrate packaging method as set forth in claim 1 , wherein the outer-packing pouch is heat-sealable, and in said second step is heat-sealed to close the pouch hermetically.