IP Library Granted Patent US 8,384,101
Granted Patent B2
US 8,384,101 · App. 12/441,247 · Granted Feb 26, 2013

Semiconductor light-emitting device

Inventors: Seiichi Tokunaga (Suita, JP); Kunio Takeuchi (Joyo, JP)
Assignee: Sanyo Electric Co., Ltd.
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Quick Facts
Patent No.
US 8,384,101
App. No.
12/441,247
Granted
Feb 26, 2013
Kind
B2
Abstract

Such a semiconductor light-emitting device ( 10, 30, 40 ) that emitted light has small directivity of light intensity and a color tone and a light output is hardly reduced is obtained. This semiconductor light-emitting device includes a semiconductor light-emitting element ( 1, 31 ) and a thin-film light diffusion portion ( 8, 8 a , 38, 41 ) arranged on a light-emitting direction side of the semiconductor light-emitting element.

Claims (44)

1. A semiconductor light-emitting device comprising:

a semiconductor light-emitting element;

a thin-film light diffusion portion arranged on a light-emitting direction side of said semiconductor light-emitting element; and

a wavelength conversion portion containing a phosphor, wherein

said wavelength conversion portion is formed into a sheet, and said light diffusion portion is formed only on the upper surface or only on the back surface of said wavelength conversion portion,

a space is formed between said light diffusion portion and said semiconductor light-emitting element.

2. The semiconductor light-emitting device according to claim 1 , wherein

said thin-film light diffusion portion includes a plurality of islandlike light diffusion portions.

3. A semiconductor light-emitting device comprising:

a semiconductor light-emitting element;

a resin portion arranged on a light-emitting direction side of said a semiconductor light-emitting element;

a wavelength conversion portion containing a phosphor arranged on said light-emitting direction side of said resin portion; and

a thin-film light diffusion portion arranged only at an interface between said resin portion and said wavelength conversion portion, wherein

said thin-film light diffusion portion is composed of a plurality of islandlike light diffusion portions.

4. The semiconductor light-emitting device according to claim 3 , wherein

said islandlike light diffusion portions have convex curved surfaces toward said light-emitting direction.

5. The semiconductor light-emitting device according to claim 3 , wherein

said light diffusion portion is formed in such a shape that a single layer is separated into a plurality of islands.

6. The semiconductor light-emitting device according to claim 3 , wherein

said light diffusion portion is formed by vapor phase deposition.

7. The semiconductor light-emitting device according to claim 3 , wherein

said light diffusion portion is arranged separately from said semiconductor light-emitting element.

8. The semiconductor light-emitting device according to claim 3 , further comprising a wavelength conversion portion containing a phosphor.

9. The semiconductor light-emitting device according to claim 8 , wherein

said wavelength conversion portion is formed into a sheet, and

said light diffusion portion is formed on the upper surface or on the back surface of said wavelength conversion portion.

10. The semiconductor light-emitting device according to claim 8 , wherein

said light diffusion portion is provided between said wavelength conversion portion and said semiconductor light-emitting element.

11. The semiconductor light-emitting device according to claim 8 , wherein

said light diffusion portion has a thickness smaller than the thickness of said wavelength conversion portion.

12. The semiconductor light-emitting device according to claim 3 , wherein

said semiconductor light-emitting element is arranged in a mirror-finished frame.

13. The semiconductor light-emitting device according to claim 3 , wherein

said light diffusion portion includes an aluminum thin film.

14. The semiconductor light-emitting device according to claim 3 , wherein

said light diffusion portion includes a titanium oxide thin film.

15. The semiconductor light-emitting device according to claim 3 , wherein

said resin has a surface formed in a corrugated shape, and

said light diffusion portion is arranged on the surface of said corrugated shape of said resin.

16. The semiconductor light-emitting device according to claim 15 , wherein

said light diffusion portion is formed in a plurality of recess portions of said corrugated shape of said resin in the form of islands.

17. The semiconductor light-emitting device according to claim 3 , wherein

said light diffusion portion is formed in a manner convexly bent toward said light-emitting direction to cover said semiconductor light-emitting element.

18. The semiconductor light-emitting device according to claim 3 , having a space between said light diffusion portion and said semiconductor light-emitting element.

Assignments (5)
SECURITY INTEREST Recorded Jan 21, 2026
From: KODIAK AI, INC.
To: HORIZON TECHNOLOGY FINANCE CORPORATION
Reel/Frame 074459/0570 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 20, 2017
From: SANYO ELECTRIC CO., LTD.
To: EPISTAR CORPORATION
Reel/Frame 041652/0122 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 1, 2016
From: FUTURE LIGHT LIMITED LIABILITY COMPANY
To: SANYO ELECTRIC CO., LTD.
Reel/Frame 040523/0797 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2012
From: SANYO ELECTRIC CO., LTD.
To: FUTURE LIGHT, LLC
Reel/Frame 027957/0258 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 13, 2009
From: TOKUNAGA, SEIICHI; TAKEUCHI, KUNIO
To: SANYO ELECTRIC CO., LTD.
Reel/Frame 022393/0180 →
Priority Claims (2)
JP 2007-005323 · Jan 15, 2007 · national
JP 2008-004024 · Jan 11, 2008 · national
Continuity (1)
Related Publication 20100044731A1 · Feb 25, 2010