IP Library Granted Patent US 8,411,197
Granted Patent B2
US 8,411,197 · App. 10/968,111 · Granted Apr 2, 2013

Image pickup device and production method thereof

Inventors: Naoyuki Watanabe (Kawasaki, JP); Toshiyuki Honda (Kawasaki, JP); Yoshito Akutagawa (Kawasaki, JP); Susumu Moriya (Kawasaki, JP); Izumi Kobayashi (Kawasaki, JP)
Assignee: Fujitsu Semiconductor Limited
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Quick Facts
Patent No.
US 8,411,197
App. No.
10/968,111
Granted
Apr 2, 2013
Kind
B2
Abstract

An image pickup device is disclosed that has little deformation caused by thermal expansion of a transparent resin for sealing an image pickup element. The image pickup device includes an image pickup element having a light receiving surface, a micro-lens for condensing incident light to the image pickup element, a first transparent plate disposed on the light receiving surface of the image pickup element with the micro-lens in between, a transparent resin that seals the image pickup element and the first transparent plate, and a second transparent plate disposed on the transparent resin to face the first transparent plate.

Claims (27)

1. An image pickup device, comprising:

an image pickup element having a light receiving surface;

a lens arranged on the light receiving surface;

a first transparent plate made of a glass material disposed over the lens on the light receiving surface of the image pickup element, but not directly contacting the light receiving surface, the first transparent plate having a surface, the surface facing the lens, and the surface being flat at least at a position directly above a position of the lens, wherein a substance different from both the first transparent plate and the lens is in existence between the surface of the first transparent plate and the lens;

a transparent material disposed on an upper surface of the first transparent plate and that seals the image pickup element; and

a second transparent plate made of a glass material directly contacting an upper surface of the transparent material,

wherein the light receiving surface includes a photodiode, and light incident from outside the image pickup device reaches the photodiode through the lens after passing through the first transparent plate, and

wherein the lens, the first transparent plate, and the second transparent plate are arranged in the following order: the lens, the first transparent plate, and the second transparent plate.

2. The image pickup device as claimed in claim 1 , wherein a surface area of the second transparent plate is greater than a surface area of the first transparent plate.

3. The image pickup device as claimed in claim 1 , wherein air is disposed between the first transparent plate and the image pickup element.

4. The image pickup device as claimed in claim 1 , wherein a light transmission adhesive material is disposed between the first transparent plate and the image pickup element.

5. The image pickup device as claimed in claim 1 , wherein the first transparent plate is in direct contact with at least a portion of the lens.

6. The image pickup device as claimed in claim 1 , wherein the second transparent plate is in contact with the first transparent plate.

7. The image pickup device as claimed in claim 1 , wherein the transparent material is interposed between the first transparent plate and the second transparent plate.

8. The image pickup device as claimed in claim 1 , wherein the transparent material is a resin.

9. A method of producing an image pickup device, comprising:

disposing an image pickup element having a light receiving surface on a substrate;

disposing a lens on the light receiving surface;

disposing a first transparent plate made of a glass material on the image pickup element and over the lens, the first transparent plate having a surface, the surface facing the lens, and the surface being flat at least at a position directly above a position of the lens, wherein a substance different from both the first transparent plate and the lens is in existence between the surface of the first transparent plate and the lens;

connecting the image pickup element with an electrode arranged on the substrate;

arranging a second transparent plate made of a glass material in a mold;

arranging the substrate on which the image pickup element and the first transparent plate are disposed so that the first transparent plate faces the second transparent plate; and

sealing the image pickup element and an upper surface of the first transparent plate with a transparent material so that the second transparent plate faces the first transparent plate across the material,

wherein the light receiving surface includes a photodiode, and light incident from outside the image pickup device reaches the photodiode through the lens after passing through the first transparent plate, and

wherein the lens, the first transparent plate, and the second transparent plate are arranged in the following order: the lens, the first transparent plate, and the second transparent plate.

10. The method as claimed in claim 9 , wherein the transparent material is interposed between the first transparent plate and the second transparent plate in the produced image pickup device.

11. The method as claimed in claim 9 , wherein the transparent material is a resin.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 27, 2015
From: FUJITSU SEMICONDUCTOR LIMITED
To: SOCIONEXT INC.
Reel/Frame 035508/0469 →
CHANGE OF NAME Recorded Sep 27, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 025046/0478 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2008
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 021976/0089 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 20, 2004
From: WATANABE, NAOYUKI; HONDA, TOSHIYUKI; AKUTAGAWA, YOSHITO; MORIYA, SUSUMU; KOBAYASHI, IZUMI
To: FUJITSU LIMITED
Reel/Frame 015912/0530 →
Priority Claims (1)
JP 2004-177598 · Jun 15, 2004 · national
Continuity (1)
Related Publication 20050275741A1 · Dec 15, 2005