Integrated circuit heat spreader stacking system
View Patent ↗An integrated circuit heat spreader stacking system includes: an integrated circuit on a substrate; a heat spreader having a heat sink dome; a stacking stand-off for the heat spreader; and the heat spreader mounted with the heat sink dome over the integrated circuit.
1. An integrated circuit heat spreader system comprising:
a substrate;
an integrated circuit on the substrate;
a heat spreader selected from a stack of heat spreaders and mounted over the integrated circuit, and the heat spreader having a heat sink dome formed above a flat body with a stacking stand-off, formed from the flat body, adjacent to a peripheral edge of and curved over the flat body,
wherein said stacking stand-off prevents corresponding two neighboring heat spreaders in said stack from sticking together by providing a vertical displacement therebetween.
2. The system as claimed in claim 1 wherein the heat spreader includes a position support feature formed in the flat body.
3. The system as claimed in claim 1 wherein the heat spreader includes a corner tab.
4. The system as claimed in claim 1 wherein the heat spreader includes a punched tab.
5. The system as claimed in claim 1 wherein the heat spreader includes a surface dimple.
6. The system as claimed in claim 1 further comprising:
an electrical interconnect coupled to the integrated circuit and the substrate; and wherein:
the heat spreader is on the substrate;
the stacking stand-off curved over the flat body by an overlap length; and
the heat spreader over the integrated circuit has the flat body further comprising an extension piece.
7. The system as claimed in claim 6 wherein the heat spreader includes a corner tab over the flat body.
8. The system as claimed in claim 6 wherein the heat spreader includes a punched tab and is the flat body punched and rolled to a vertical position.
9. The system as claimed in claim 6 wherein the heat spreader includes a surface dimple for the vertical displacement in the stack.