Heat-resistant adhesive sheet for substrateless semiconductor package fabrication and method for fabricating substrateless semiconductor package using the adhesive sheet
The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step. To solve these problems, the present invention provides an adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer has a specific adhesion strength and peel strength.
1. A heat-resistant adhesive sheet for semiconductor device fabrication:
the heat-resistant adhesive sheet is bonded to a substrateless semiconductor chip during a period when the substrateless semiconductor chip is encapsulated with a resin to form a package, wherein
the heat-resistant adhesive sheet comprises a base material layer and an adhesive layer, the adhesive layer when bonded has an adhesion strength to SUS304 greater than or equal to 0.5 N/20 mm, and the adhesive layer is cured by stimulation received in a period between completion of bonding the heat-resistant adhesive sheet to the substrateless semiconductor chip and completion of resin encapsulating the substrateless semiconductor chip so that a peel strength of the adhesive layer from the package reduces to 2.0 N/20 mm or less.
2. The heat-resistant adhesive sheet for semiconductor device fabrication according to claim 1 , wherein the adhesive layer is made of a radiation curable adhesive.
3. The heat-resistant adhesive sheet for semiconductor device fabrication according to claim 1 , wherein the radiation curable adhesive is an ultraviolet curable adhesive.
4. The heat-resistant adhesive sheet for semiconductor device fabrication according to claim 1 , wherein the radiation curable adhesive is curable when heated.
5. The heat-resistant adhesive sheet for semiconductor device fabrication according to claim 1 , wherein the adhesive layer comprises a rubber component and an epoxy resin component, the rubber component and the epoxy resin component cure in a period between completion of bonding and completion of resin encapsulation, the proportion of the rubber component in an organic substance in the adhesive is in the range of 20 to 60 wt %.
6. A method for fabricating a substrateless semiconductor package using a heat-resistant adhesive sheet for semiconductor device fabrication according to claim 1 .