Resistive memory
View Patent ↗A memory device memory device includes a first array of memory structures disposed in rows and columns and constructed over a substrate, each memory structure having a first signal electrode, a second signal electrode, and a resistive layer positioned between the first signal electrode and the second signal electrode.
1. A memory device, comprising:
a first array of memory structures disposed in rows and columns and constructed over a substrate, each memory structure comprising:
a first signal electrode,
a second signal electrode, and
a resistive layer positioned between the first signal electrode and the second signal electrode with an amorphous or crystalline conduction channel and lateral composition gradient; and
a second array of memory structures disposed in rows and columns and constructed either above or below the first array of memory, each memory structure comprising a first signal electrode, a second signal electrode, and a resistive layer between the first signal electrode and the second signal electrode, wherein the second array increases storage capacity of the memory device.
2. The memory device of claim 1 , further comprising a driver circuit for selectively controlling first signal electrodes or second signal electrodes.
3. The memory device of claim 2 , wherein the circuit includes one or more of a sense amplifier, an input-output buffer, an X address decoder, a Y address decoder, and an address buffer.
4. The memory device of claim 1 , wherein the substrate includes a silicon-on-insulator wafer.
5. The memory device of claim 1 , wherein the resistive layer is spin-coated over the substrate wherein first signal electrodes and the second signal electrodes are constructed.
6. The memory device of claim 1 , wherein the resistive layer form memory circuits, analog circuits, hybrid circuits, or logic circuits.
7. The memory device of claim 1 , wherein the resistive layer forms transistors.
8. The memory device of claim 1 , wherein the resistive layer store data at intersections of resistors.
9. The memory device of claim 1 , further comprising an array of redundant memory elements.
10. The memory device of claim 9 , wherein the redundant array is a row or a column of redundant resistive-elements.
11. The memory device of claim 1 , comprising magnetic elements or optical elements coupled to the memory.
12. The memory device of claim 1 , further comprising memory devices forming a plurality of memory hierarchy to optimize data access speed.
13. A memory electronic device, comprising:
a substrate;
a first layer fabricated using semiconductor fabrication techniques;
a second layer formed above the first layer, the second layer having one or more resistive-bonding areas and one or more resistive memory elements self-assembled to the second layer resistive bonding areas; and
a third layer formed above the second layer, the third layer having one or more resistive-bonding areas and one or more resistive memory elements self-assembled to the third layer resistive bonding areas.
14. The device of claim 13 , wherein the resistive-elements are spin-coated on the second layer.
15. A memory electronic device, comprising:
a substrate;
a first layer fabricated using semiconductor fabrication techniques;
a second layer formed above the first layer, the second layer having one or more resistive-bonding areas and one or more resistive memory elements self-assembled to the second layer resistive bonding areas, wherein the resistive layer comprises a combination of two resistive elements that in combination have a zero temperature coefficient.
16. A memory electronic device, comprising:
a substrate;
a first layer fabricated using semiconductor fabrication techniques;
a second layer formed above the first layer, the second layer having one or more resistive-bonding areas;
a plurality of resistive memory elements self-assembled to the second layer resistive bonding areas, wherein each resistive memory element has a zero temperature coefficient.
17. The device of claim 16 , comprising a first resistive element with a positive temperature coefficient and the second resistive element with a negative temperature coefficient.
18. The device of claim 16 , wherein the temperature coefficient is selected such that a series or parallel combination of two elements results in a resistive element having zero temperature coefficient.