Method of depositing film by atomic layer deposition with pulse-time-modulated plasma

1. A method of depositing a film by atomic layer deposition (ALD) with pulse-time-modulated plasma, comprising:

introducing a precursor gas in pulses over a substrate;

introducing a reactant gas over a substrate; and

applying pulse-time-modulated RF power in pulses onto the substrate, wherein a main pulse of the pulse-time-modulated RF power is applied onto the substrate during intervals between two consecutive pulses of the precursor gas while the reactant gas is being introduced and no pulse of the pulse-time-modulated RF power is applied onto the substrate during the pulses of the precursor gas,

wherein the main pulse of the pulse-time-modulated RF power is comprised of a plurality of secondary pulses of RF power wherein one cycle of each secondary pulse is about 3 milliseconds (msec) to about 1,000 msec, and a duty of the cycle is about 60% or higher, wherein a duration of no RF power period between two consecutive secondary pulses of RF power is about 1 msec to about 300 msec.

2. The method according to claim 1 , wherein the reactant gas is introduced in pulses.

3. The method according to claim 1 , wherein the main pulse of the pulse-time-modulated RF power has a duration of about 0.1 sec to about 10 sec, and an interval between two consecutive main pulses of the pulse-time-modulated RF power is about 0.3 sec to about 5 sec.

4. The method according to claim 1 , wherein one cycle of each secondary pulse is about 40 msec to about 600 msec.

5. The method according to claim 1 , wherein the duty of the cycle of each secondary pulse is about 75% or higher.

6. The method according to claim 1 , wherein one cycle of each secondary pulse is about 8 msec to about 1,000 msec, and a duty of the cycle is about 60% or higher.

7. The method according to claim 6 , wherein the one cycle of each secondary pulse is about 100 msec to about 500 msec, and a duty of the cycle is about 75% or higher.

8. The method according to claim 2 , wherein in one cycle of introducing the precursor over the substrate and in one cycle of introducing the reactant gas, a duration of flow of the precursor is 0.2 to 5 seconds, a duration of flow of the reactant gas is 0.2 to 5 seconds, and an interval between the precursor flow and the reactant gas flow is 0.2 to 5 seconds.

9. The method according to claim 1 , wherein the reactant gas is continuously supplied in the precursor adsorption process.

10. The method according to claim 1 , wherein a purge process is provided between the precursor adsorption process and plasma treatment process using a reactant gas.

11. The method according to claim 1 , wherein the precursor is at least one type of material selected from the group that includes silicon.

12. The method according to claim 1 , wherein the thin film is constituted by a silicon compound.

13. The method according to claim 1 , wherein the reactant gas is NO 2 , O 2 , H 2 , CO 2 , N 2 O, N 2 and/or NH 3 .

14. The method according to claim 1 , wherein the precursor is a gas having an aminosilane group.

15. The method according to claim 1 , wherein the thin film is constituted by a metal oxide compound or metal oxide composite.

16. The method according to claim 11 , wherein the thin film is constituted by SiO, SiN, SiC, SiON, SiCON, SiCO, SiBN, SiBO or SiCN.

17. The method according to claim 1 , wherein the RF power generating the plasma in is less than 0.7 W/cm 2 per area of the substrate.

18. The method according to claim 1 , wherein the process pressure in the process of forming the film is in a range of 50 to 2000 Pa.

19. The method according to claim 1 , wherein the plasma is generated in a gap between capacitively-coupled parallel plate electrodes.

20. The method according to claim 1 , wherein the duration of RF power period between two consecutive secondary pulses of RF power is about 30 msec to about 150 msec.