Forming substrate structure by filling recesses with deposition material
A substrate structure is produced by forming a first material layer on a substrate having a recess, removing the first material layer from the portion of the substrate except for the recess using a second material that reacts with the first material, and forming a deposition film from the first material layer using a third material that reacts with the first material. A method of manufacturing a device may include the method of forming a substrate structure.
1. A method for forming a structure on a substrate formed with at least one recess, comprising:
(a) depositing a layer of material on the substrate, the material deposited on surfaces within the at least one recess;
(b) removing the deposited layer of material in first portions of the at least one recess shallower than a predetermined depth;
(c) depositing another layer of material on the substrate and surfaces within the at least one recess;
(d) removing the other layer of deposited material in the first portions of the at least one recess shallower than the predetermined; and
(e) repeating (c) and (d) until second portions of the at least one recess at the predetermined depth and deeper than the predetermined depth are filled with the material.
2. The method of claim 1 , wherein depositing the layer of material or depositing the other layer of the material comprises:
exposing the substrate to a source precursor; and
exposing the substrate exposed to the source precursor with a reactant precursor to deposit the layer of material by atomic layer deposition.
3. The method of claim 1 , wherein the deposited layer of material is removed from the first portions by controlling diffusion depth of a reactive material for removing the deposited layer into the at least one recess.
4. The method of claim 3 , wherein the diffusion depth of the reactive material is controlled by one or more of ejection speed of the reactive gas, ejection time of the reactive gas and moving rate of the substrate.
5. The method of claim 1 , wherein the deposited layer of material is removed from the first portions by exposing the substrate deposited with the material to electromagnetic radiation directed at an angle relative to a top surface of the substrate.
6. The method of claim 5 , wherein the electromagnetic radiation comprises at least one of microwave or ultraviolet light.
7. The method of claim 5 , further comprising ejecting a reactant material onto the substrate, wherein the reactant material reacts with the deposited material and removes the deposited material when exposed to the electromagnetic radiation.
8. The method of claim 1 , wherein the layer of deposited material comprises an atomic layer of silicon, aluminum or titanium.
9. The method of claim 1 , wherein the at least one recess is part of a shallow trench isolation (STI) structure, contact holes or via holes.
10. The method of claim 1 , further comprising forming OH bonds on the surfaces of the substrate before depositing the layer of material.
11. The method of claim 1 , wherein the deposited layer of material comprises oxide or nitride.
12. The method of claim 5 , further comprising repeating the depositing of the layer and the exposing the substrate to the electromagnetic radiation.
13. The method of claim 1 , further comprising exposing the substrate to plasma generated at a location away from the substrate.