IP Library Granted Patent US 8,502,328
Granted Patent B2
US 8,502,328 · App. 13/409,020 · Granted Aug 6, 2013

Micro electronic mechanical system structure

Inventors: Tsai-Chiang Nieh (Hsinchu County, TW); Tung-Ming Lai (Hsinchu, TW); Feng-Tsai Tsai (Tainan, TW)
Assignee: Maxchip Electronics Corp.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,502,328
App. No.
13/409,020
Granted
Aug 6, 2013
Kind
B2
Abstract

A micro electronic mechanical system structure and a manufacturing method thereof are provided. A substrate has a plurality of conductive regions is provided. A dielectric layer is formed on the substrate. A plurality of openings and recesses are formed in the dielectric layer, wherein the openings expose the conductive regions. The recesses are located between the openings. A conductive layer is formed on the dielectric layer and the openings and the recesses are filled with the conductive layer. The conductive layer is patterned to form a plurality of strips of the first conductive patterns on the dielectric layer and a second conductive pattern on the sidewall and the bottom of each recess, wherein the first conductive patterns are connected with each other through the second conductive patterns. The dielectric layer is removed. The second conductive patterns between the first conductive patterns are removed.

Claims (8)

1. A micro electronic mechanical system structure, comprising:

a substrate having a plurality of conductive regions;

a plurality of strips of conductive patterns arranged in parallel, disposed on the substrate;

a plurality of contact windows, disposed between the conductive patterns and the substrate to electrically connect the conductive patterns and the conductive regions; and

a plurality of protrusion portions, disposed under the conductive patterns, located between the contact windows, and connected with the conductive patterns.

2. The micro electronic mechanical system structure of claim 1 , wherein the protrusion portions are located at an edge of each of the conductive patterns.

3. The micro electronic mechanical system structure of claim 2 , wherein a material of the protrusion portions is identical to a material of the conductive patterns.

4. The micro electronic mechanical system structure of claim 1 , wherein a portion of the protrusion portions is located at an edge of a portion of the conductive patterns, and another portion of the protrusion portions extends from one end of another portion of the conductive patterns to another end.

Assignments (1)
CHANGE OF NAME Recorded Jun 26, 2019
From: MAXCHIP ELECTRONICS CORP.
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049602/0574 →
Priority Claims (1)
TW 99100680 A · Jan 12, 2010 · national
Continuity (2)
Division 12721546 · Mar 10, 2010
Related Publication 20120153469A1 · Jun 21, 2012