IP Library › Assignment 049602/0574
Patent Assignment
Reel/Frame 049602/0574

Change of Name

Recorded: 2019-06-26 Pages: 6
Assignor
MAXCHIP ELECTRONICS CORP.
Executed: 2018-09-11
Assignee
POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
NO. 18, LISING 1ST RD., EAST DISTRICT,, HSINCHU CITY, 300, TAIWAN
Covered Properties (10)
Method of Measuring Numerical Aperture of Exposure Machine, Control Wafer, Photomask, and Method of Monitoring Numerical Aperture of Exposure Machine
Patent: 8,134,708 →
Application: 12/337,606 →
Publication: US 2010/0149535
Ambit Light Sensor with Function of Ir Sensing
Patent: 8,558,177 →
Application: 12/696,026 →
Publication: US 2011/0108728
Manufacturing Method of Micro Electronic Mechanical System Structure
Patent: 8,163,583 →
Application: 12/721,546 →
Publication: US 2011/0169106
Semiconductor Structure
Patent: 8,907,395 →
Application: 13/244,640 →
Publication: US 2013/0043522
Micro Electronic Mechanical System Structure
Patent: 8,502,328 →
Application: 13/409,020 →
Publication: US 2012/0153469
Method of Forming Semiconductor Structure
Patent: 8,895,386 →
Application: 13/632,162 →
Publication: US 2014/0024183
Multi-Wave Band Light Sensor Combined with Function of Ir Sensing and Method of Fabricating the Same
Patent: 9,136,301 →
Application: 14/020,908 →
Publication: US 2014/0008653
Light Sensor
Patent: 9,142,583 →
Application: 14/089,769 →
Publication: US 2015/0091123
High Voltage Bootstrap Gate Driving Apparatus
Patent: 9,379,696 →
Application: 14/294,176 →
Publication: US 2015/0311891
Method of Forming Semiconductor Structure
Patent: 8,980,703 →
Application: 14/505,510 →
Publication: US 2015/0024562
Related Assignments (8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 26, 2008
From: WU, CHIEN-MIN; CHEN, CHIEN-CHIH
To: MAXCHIP ELECTRONICS CORP.
Reel/Frame 022030/0494 →
Assignment of Assignor's Interest Feb 8, 2010
From: CHANG, JIN-WEI; HSU, JEN-YAO; WANG, HONG-XIAN; CHEN, YU-HSIEN
To: MAXCHIP ELECTRONICS CORP.
Reel/Frame 023908/0736 →
Assignment of Assignor's Interest Mar 17, 2010
From: NIEH, TSAI-CHIANG; LAI, TUNG-MING; TSAI, FENG-TSAI
To: MAXCHIP ELECTRONICS CORP.
Reel/Frame 024097/0623 →
Assignment of Assignor's Interest Sep 28, 2011
From: HSU, CHEN-CHIU; LAI, TUNG-MING; HSUEH, KAI-AN; HUANG, MING-DE
To: MAXCHIP ELECTRONICS CORP.
Reel/Frame 026977/0898 →
Assignment of Assignor's Interest Oct 3, 2012
From: HSU, CHEN-CHIU; LAI, TUNG-MING; HSUEH, KAI-AN; HUANG, MING-DE
To: MAXCHIP ELECTRONICS CORP.
Reel/Frame 029065/0398 →
Assignment of Assignor's Interest Sep 10, 2013
From: CHANG, JIN-WEI; WANG, HUNG-LUNG; HUNG, JUNG-KAI
To: MAXCHIP ELECTRONICS CORP.
Reel/Frame 031169/0463 →
Assignment of Assignor's Interest Feb 17, 2014
From: CHANG, JIN-WEI; WANG, HUNG-LUNG; HUNG, JUNG-KAI; SU, WEI-CHI
To: MAXCHIP ELECTRONICS CORP.
Reel/Frame 032226/0479 →
Assignment of Assignor's Interest Jun 9, 2014
From: KUO, MING-CHI; TSAI, TSUNG-CHIH; HSU, JEN-YAO
To: MAXCHIP ELECTRONICS CORP.
Reel/Frame 033053/0469 →