IP Library Granted Patent US 8,519,465
Granted Patent B2
US 8,519,465 · App. 13/553,386 · Granted Aug 27, 2013

Semiconductor device and method of fabricating the same

Inventors: Jung-Hwan Kim (Seongnam-si, KR); Hun-Hyeoung Leam (Yongin-si, KR); Tae-Hyun Kim (Suwon-si, KR); Seok-Woo Nam (Yongin-si, KR); Hyun Namkoong (Anyang-si, KR); Yong-Seok Kim (Seoul, KR); Tea-Kwang Yu (Suwon-si, KR)
Assignee: Samsung Electronics Co., Ltd.
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Quick Facts
Patent No.
US 8,519,465
App. No.
13/553,386
Granted
Aug 27, 2013
Kind
B2
Abstract

A semiconductor device includes an isolation layer defining an active region formed in a semiconductor substrate. A first recessing process is performed on the isolation layer to expose edge portions of the active region. A first rounding process is performed to round the edge portions of the active region. A second recessing process is performed on the isolation layer. A second rounding process is performed to round the edge portions of the active region.

Claims (27)

1. A semiconductor device comprising:

an isolation layer recessed from a surface of a semiconductor substrate; and

an active region included in the semiconductor substrate defined by the isolation layer, the active region protruding upward with respect to the isolation layer,

wherein the active region includes a top surface and a side surface that has at least two bend points.

2. The semiconductor device of claim 1 , wherein one of the bend points is adjacent to the top surface of the isolation layer.

3. The semiconductor device of claim 1 , further comprising a finfet gate structure disposed on the active region.

4. The semiconductor device of claim 1 , wherein the top surface of the active region has a round shape.

5. The semiconductor device of claim 1 , wherein another of the bend points is located between the top surface of the active region and the side surface of the active region.

6. The semiconductor device of claim 1 , wherein a slope of the side surface changes at each of the bend points of the side surface

7. The semiconductor device of claim 1 , wherein the side surface of the active region comprises a first side surface on the first bend point and a second side surface under the first bend point.

8. The semiconductor device of claim 7 , wherein the first side surface and the second side surface have different slopes.

9. A semiconductor device comprising:

an isolation layer recessed from a surface of a semiconductor substrate;

an active region included in the semiconductor substrate defined by the isolation layer; and

a finfet gate structure disposed on the active region, the active region protruding upward with respect to the isolation layer,

wherein a side surface of the active region has at least two bend points.

10. The semiconductor device of claim 9 , wherein one of the bend points is adjacent to a top surface of the isolation layer.

11. The semiconductor device of claim 9 , wherein the top surface of the active region has a round shape.

12. The semiconductor device of claim 9 , wherein another of the bend points is located between the top surface of the active region and the side surface of the active region.

13. The semiconductor device of claim 9 , wherein a slope of the side surface changes at each of the bend points of the side surface

14. The semiconductor device of claim 9 , wherein the side surface of the active region comprises a first side surface on the first bend point and a second side surface under the first bend point.

15. The semiconductor device of claim 14 , wherein the first side surface and the second side surface have different slopes.

16. The semiconductor device of claim 9 , where the at least two bend points comprise a first bend point adjacent to a top surface of the isolation layer and a second bend point.

17. The semiconductor device of claim 16 , wherein a first slope of the side surface of the active region protruding upward with respect to the isolation layer changes from a second slope of the side surface of the active region defined by the isolation layer at the first bend point of the side surface.

18. The semiconductor device of claim 16 , wherein a first slope of the side surface of the active region adjacent to the top surface of the active region changes from a first slope of the side surface of the active region protruding upward with respect to the isolation layer.

19. The semiconductor device of claim 1 , wherein the active region comprises semiconductor material.

20. The semiconductor device of claim 1 , wherein at least one doped region is formed in the active region.

Priority Claims (1)
KR 10-2007-0038327 · Apr 19, 2007 · national
Continuity (6)
Continuation 13079635 · Apr 4, 2011
Continuation 12906652 · Oct 18, 2010
Division 11931571 · Oct 31, 2007
Continuation In Part 11149396 · Jun 9, 2005
Division 10446970 · May 28, 2003
Related Publication 20120286369A1 · Nov 15, 2012