IP Library Granted Patent US 8,549,092
Granted Patent B2
US 8,549,092 · App. 12/389,200 · Granted Oct 1, 2013

Memory network methods, apparatus, and systems

Inventor: David R. Resnick (Boise, ID)
Assignee: Micron Technology, Inc.
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Quick Facts
Patent No.
US 8,549,092
App. No.
12/389,200
Granted
Oct 1, 2013
Kind
B2
Abstract

Apparatus and systems may include a first node group include a first network node coupled to a memory, the first network node including a first port, a second port, a processor port, and a hop port. Network node group may include a second network node coupled to a memory, the second network node including a first port, a second port, a processor port, and a hop port, the hop port of the second network node coupled to the hop port of the first network node and configured to communicate between the first network node and the second network node. Network node group may include a processor coupled to the processor port of the first network node and coupled to the processor port of the second network node, the processor configured to access the first memory through the first network node and the second memory through the second network node. Other apparatus, systems, and methods are disclosed.

Claims (24)

1. An apparatus comprising:

a first node group including:

a first network node coupled to a first memory, the first network node including a first port, a second port, a processor port, and a hop port;

a second network node coupled to a second memory, the second network node including a first port, a second port, a processor port, and a hop port, the hop port of the second network node coupled to the hop port of the first network node providing a hop path, the hop port of the second network node and the hop port of the first network node configured to communicate between the first network node and the second network node such that a request at the first network node, for data not in the first network node and not in the first memory coupled to the first network node, is automatically sent via the hop path to the second network node prior to being sent to another node group if the data is not in the second network node and not in the second memory coupled to the second network node; and

a processor coupled to the processor port of the first network node and coupled to the processor port of the second network node, the processor configured to access the first memory through the first network node and the second memory through the second network node.

2. The apparatus of claim 1 , configured to communicatively couple to a second node group, the second node group comprising:

a third network node coupled to a memory, the third network node including a first port, a second port, a processor port, and a hop port;

a fourth network node coupled to a memory, the fourth network node including a first port, a second port, a processor port, and a hop port, the hop port of the fourth network node coupled to the hop port of the third network node; and

a second processor coupled to the third network node using the processor port of the third network node and coupled to the fourth network node using the processor port of the fourth network node, wherein one of the first and second ports of the third network node is coupled to one of the first and second ports of the first network node.

3. The apparatus of claim 1 , wherein the memory coupled to the first network node comprises at least one Dynamic Random Access Memory (DRAM) array.

4. The apparatus of claim 1 , wherein the first network node comprises an input/output driver circuit.

5. The apparatus of claim 1 , wherein the first network node and the memory coupled to the first network node are disposed in a single package.

6. The apparatus of claim 1 , wherein the first network node, the memory coupled to the first network node and the processor coupled to the first network node are disposed in a single package.

7. The apparatus of claim 1 , wherein the second network node and the memory coupled to the second network node is disposed in a single package.

8. The apparatus of claim 1 , wherein the second network node, the memory coupled to the second network node and the processor coupled to the second network node are disposed in a single package.

9. The apparatus of claim 1 , wherein the first network node is configured to perform Error Check and Correction (ECC) during data communication between the first memory and the first processor.

10. The apparatus of claim 1 , wherein the memory coupled to the first network node comprises a NAND flash memory array.

11. The apparatus of claim 1 , wherein the memory coupled to the first network node comprises a NOR flash memory array.

12. The apparatus of claim 1 , wherein the processor coupled to the first network node comprises a single-core processor.

13. The apparatus of claim 1 , wherein the processor coupled to the first network node comprises a multi-core processor.

14. The apparatus of claim 1 , wherein the processor coupled to the first network node is a single core of a multi-core processor.

15. The apparatus of claim 1 , wherein the processor coupled to the first network node comprises an Application Specific Integrated Circuit (ASIC).

16. The apparatus of claim 1 , wherein the processor coupled to the first network node comprises a substrate with embedded processors.

17. The apparatus of claim 1 , wherein the apparatus includes a memory network in which the first node group and associated memories are disposed, the memory network structured to operate with a single set of addresses in the network.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 24, 2009
From: RESNICK, DAVID R.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 022444/0626 →
Continuity (1)
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