IP Library Granted Patent US 8,563,133
Granted Patent B2
US 8,563,133 · App. 11/299,299 · Granted Oct 22, 2013

Compositions and methods for modulation of nanostructure energy levels

Inventors: Jeffery A. Whiteford (Belmont, CA); Mihai A. Buretea (San Francisco, CA); Jian Chen (San Mateo, CA); William P. Freeman (San Mateo, CA); Andreas Meisel (San Francisco, CA); Linh Nguyen (San Jose, CA); J. Wallace Parce (Palo Alto, CA); Erik Scher (San Francisco, CA)
Assignee: SanDisk Corporation
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Quick Facts
Patent No.
US 8,563,133
App. No.
11/299,299
Granted
Oct 22, 2013
Kind
B2
Abstract

Ligand compositions for use in preparing discrete coated nanostructures are provided, as well as the coated nanostructures themselves and devices incorporating same. Methods for post-deposition shell formation on a nanostructure, for reversibly modifying nanostructures, and for manipulating the electronic properties of nanostructures are also provided. The ligands and coated nanostructures of the present invention are particularly useful for close packed nanostructure compositions, which can have improved quantum confinement and/or reduced cross-talk between nanostructures. Ligands of the present invention are also useful for manipulating the electronic properties of nanostructure compositions (e.g., by modulating energy levels, creating internal bias fields, reducing charge transfer or leakage, etc.).

Claims (27)

1. A ligand composition for modulating nanostructure energy levels, the ligand comprising:

a nonconjugated core and a dipole, and a nanostructure binding moiety coupled to the nonconjugated core,

wherein the nonconjugated core comprises a carborane.

2. The ligand of claim 1 , wherein the carborane further comprises one or more heteroatoms, alkyl moieties, alkynyl moieties, aromatic group, or a combination thereof.

3. The ligand of claim 1 , wherein the ligand comprises

4. The ligand of claim 1 , wherein the dipole comprises a fluorine-containing composition.

5. The ligand of claim 4 , wherein the fluorine containing composition comprises F—, HO 2 C—CF 3 or a SiF derivative.

6. The ligand of claim 1 , wherein the ligand comprises a light activated intramolecular salt.

7. The ligand of claim 1 , wherein the ligand comprises a boron-containing composition.

8. The ligand of claim 1 , further comprising a second dipole.

9. The ligand of claim 1 , wherein the nanostructure binding moiety comprises one or more phosphonic acid, carboxylic acid, amine, phosphine, or thiol moieties.

10. A nonpolymeric nanostructure composition comprising a plurality of nanostructures, wherein each member nanostructure is coupled to a plurality of the ligand of claim 1 .

11. A ligand for modulating nanostructure energy levels, the ligand comprising:

a nanostructure binding moiety coupled to a light-activated spiropyran salt.

12. The ligand of claim 11 , wherein the nanostructure binding moiety comprises one or more phosphonic acid, carboxylic acid, amine, phosphine, or thiol moieties.

13. A nonpolymeric nanostructure composition comprising a plurality of nanostructures, wherein each member nanostructure is coupled to a plurality of the ligand of claim 11 .

14. A ligand for modulating nanostructure energy levels, the ligand comprising:

a nanostructure binding moiety coupled to a boron-containing oligomer.

15. The ligand of claim 14 , wherein the boron-containing oligomer comprises an oligomeric composition having the formula (AB) n , wherein A is an aryl moiety and B is a boron atom.

16. The ligand of claim 15 , wherein the aryl moiety comprises a benzene ring, and wherein the boron atoms are positioned para to one another.

17. The ligand of claim 15 , wherein the aryl moiety comprises a benzene ring, and wherein the boron atoms are positioned meta to one another.

18. A ligand for modulating nanostructure energy levels, the ligand comprising:

a nanostructure binding moiety coupled to a thiophene moiety; and

a boron atom.

19. The ligand of claim 18 , wherein the nanostructure binding moiety comprises the boron atom.

20. The ligand of claim 18 , wherein the ligand composition comprises

21. A nonpolymeric nanostructure composition comprising a plurality of nanostructures, wherein each member nanostructure is coupled to a plurality of the ligand of claim 18 .

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 12, 2021
From: SANDISK TECHNOLOGIES LLC
To: WODEN TECHNOLOGIES INC.
Reel/Frame 058871/0928 →
CHANGE OF NAME Recorded May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038809/0472 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 14, 2016
From: SANDISK CORPORATION
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 038438/0904 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 5, 2012
From: NANOSYS, INC.
To: SANDISK CORPORATION
Reel/Frame 028322/0149 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2006
From: WHITEFORD, JEFFERY A.; BURETEA, MIHAI A.; CHEN, JIAN; FREEMAN, WILLIAM P.; MEISEL, ANDREAS; NGUYEN, LINH; PARCE, J. WALLACE; SCHER, ERIK C.
To: NANOSYS, INC.
Reel/Frame 017404/0331 →
Continuity (5)
Continuation In Part 11147670 · Jun 7, 2005
Provisional Application 60635799 · Dec 13, 2004
Provisional Application 60578236 · Jun 8, 2004
Provisional Application 60632570 · Nov 30, 2004
Related Publication 20080118755A1 · May 22, 2008