Protecting sidewalls of semiconductor chips using insulation films
A method of forming an integrated circuit structure includes providing a wafer having a first semiconductor chip, a second semiconductor chip, and a scribe line between and adjoining the first semiconductor chip and the second semiconductor chip; forming a notch in the scribe line, wherein the notch has a bottom no higher than a top surface of a semiconductor substrate in the wafer; forming a first insulation film over the wafer, wherein the first insulation film extends into the notch; removing a portion of the first insulation film from a center of the notch, wherein a remaining portion of the first insulation film comprises an edge in the notch; and sawing the wafer to separate the first semiconductor chip and the second semiconductor chip.
1. A method of forming an integrated circuit structure, the method comprising:
providing a wafer comprising:
a semiconductor substrate;
an interconnect structure over the semiconductor substrate;
a first semiconductor chip comprising a first portion of the semiconductor substrate and a first portion of the interconnect structure;
a second semiconductor chip comprising a second portion of the semiconductor substrate and a second portion of the interconnect structure; and
a scribe line between and adjoining the first semiconductor chip and the second semiconductor chip;
forming a notch in the scribe line, wherein the notch extends from a top surface of the wafer to stop at an intermediate level between a top surface and a bottom surface of the semiconductor substrate, and extends substantially from one end to an opposite end of the scribe line, wherein the notch comprises a bottom surface, with the bottom surface being a surface of a semiconductor material of the semiconductor substrate;
forming a first insulation film over the wafer, wherein the first insulation film extends into the notch and contacts the bottom surface of the notch;
patterning the first insulation film to remove a portion of the first insulation film from a center of the notch, wherein a remaining portion of the first insulation film comprises a first edge in the notch;
forming a second insulation film over the first insulation film, wherein the second insulation film extends into the notch and contacts the bottom surface of the notch;
patterning the second insulation film to remove a portion of the second insulation film from the center of the notch, wherein a remaining portion of the second insulation film comprises a second edge in the notch, and wherein a bottom surface of the first insulation film in the notch and a bottom surface of the second insulation film in the notch are level with each other; and
sawing the wafer to separate the first semiconductor chip and the second semiconductor chip.
2. The method of claim 1 , wherein the notch comprises slanted sidewalls.
3. The method of claim 1 further comprising:
forming a redistribution line between the first insulation and the second insulation film; and
forming a solder ball on a top surface of the wafer, wherein the solder ball is electrically connected to the redistribution line through an opening in the second insulation film.
4. The method of claim 1 , wherein during the step of sawing, a kerf for the sawing is horizontally between, and spaced apart from, the first edge and the second edge, and wherein the first edge and the second edge are both located in the first semiconductor chip after the step of sawing.
5. The method of claim 1 , wherein after the step of patterning the second insulation film, a remaining portion of the second insulation film covers the first edge of the first insulation film.
6. The method of claim 1 , wherein the step of forming the notch is performed by a laser, and wherein the notch has substantially vertical sidewalls.
7. The method of claim 1 , wherein the interconnect structure comprises:
dielectric layers; and
metal lines and vias in the dielectric layers.
8. A method of forming an integrated circuit structure, the method comprising:
providing a wafer comprising:
a semiconductor substrate;
an interconnect structure over the semiconductor substrate;
a first semiconductor chip comprising a first portion of the semiconductor substrate and a first portion of the interconnect structure;
a second semiconductor chip comprising a second portion of the semiconductor substrate and a second portion of the interconnect structure; and
a scribe line between and adjoining the first semiconductor chip and the second semiconductor chip;
forming a notch in the scribe line, wherein the notch extends from a top surface of the wafer to stop at an intermediate level between a top surface and a bottom surface of the semiconductor substrate, and extends substantially from one end to an opposite end of the scribe line, wherein the notch comprises a bottom surface, with the bottom surface being a surface of a semiconductor material of the semiconductor substrate;
forming a first insulation film over the wafer, wherein the first insulation film extends into the notch and contacts the bottom surface of the notch;
patterning the first insulation film to remove a portion of the first insulation film from a center of the notch, wherein a remaining portion of the first insulation film comprises a first edge in the notch;
forming a second insulation film over the first insulation film, wherein the second insulation film extends into the notch and contacts the bottom surface of the notch;
patterning the second insulation film to remove a portion of the second insulation film from the center of the notch, wherein a remaining portion of the second insulation film comprises a second edge in the notch, and wherein the bottom surface of the first insulation film in the notch and the bottom surface of the second insulation film in the notch are coplanar; and
sawing the wafer to separate the first semiconductor chip and the second semiconductor chip.
9. The method of claim 8 , wherein the notch comprises slanted sidewalls.
10. The method of claim 8 further comprising:
forming a redistribution line between the first insulation and the second insulation film; and
forming a solder ball on a top surface of the wafer, wherein the solder ball is electrically connected to the redistribution line through an opening in the second insulation film.
11. The method of claim 8 , wherein during the step of sawing, a kerf for the sawing is horizontally between, and spaced apart from, the first edge and the second edge, and wherein the first edge and the second edge are both located in the first semiconductor chip after the step of sawing.
12. The method of claim 8 , wherein after the step of patterning the second insulation film, a remaining portion of the second insulation film covers the first edge of the first insulation film.
13. The method of claim 8 , wherein the step of forming the notch is performed by a laser, and wherein the notch has substantially vertical sidewalls.
14. The method of claim 8 , wherein the interconnect structure comprises:
dielectric layers; and
metal lines and vias in the dielectric layers.