Pitch reduction using oxide spacer
A method for etching an etch layer disposed over a substrate and below an antireflective coating (ARC) layer and a patterned organic mask with mask features is provided. The substrate is placed in a process chamber. The ARC layer is opened. An oxide spacer deposition layer is formed. The oxide spacer deposition layer on the organic mask is partially removed, where at least the top portion of the oxide spacer deposition layer is removed. The organic mask and the ARC layer are removed by etching. The etch layer is etched through the sidewalls of the oxide spacer deposition layer. The substrate is removed from the process chamber.
1. A method for etching an etch layer disposed over a substrate and below an antireflective coating (ARC) layer and a patterned organic mask with mask features, the method comprising:
(a) placing the substrate in a process chamber;
(b) opening the ARC layer through the mask features of the patterned mask;
(c) forming an oxide spacer deposition layer, the oxide spacer deposition layer including a top portion, side walls, and a bottom portion, the top portion covering a top of the organic mask, the side walls covering side walls of the organic mask, and the bottom portion covering a bottom of the mask features;
(d) partially removing, by etching, the oxide spacer deposition layer on the organic mask, at least the top portion of the oxide spacer deposition layer being removed;
(e) removing, by etching, the organic mask and the ARC layer;
(f) etching the etch layer through the sidewalls of the oxide spacer deposition layer; and
(g) removing the substrate from the process chamber, wherein (c) forming the oxide spacer deposition layer comprises a plurality of cycles, each cycle comprising:
a deposition phase including:
providing a flow of a deposition gas containing Si;
forming a plasma from the deposition gas; and
stopping the flow of the deposition gas; and
a treatment phase including:
providing a flow of a treatment gas containing at least one of O 2 or N 2 ;
forming a plasma from the treatment gas; and
stopping the flow of the treatment gas.
2. The method of claim 1 , wherein (c) forming the oxide spacer deposition layer comprises three (3) to fifteen (15) cycles.
3. The method of claim 1 wherein (c) forming the oxide spacer deposition layer comprises about ten (10) cycles.
4. The method of claim 1 , wherein the deposition gas includes Silane and hydrocarbon.
5. The method of claim 4 , wherein the deposition gas includes SiH 4 and CH 3 F.
6. The method of claim 4 , wherein the deposition gas is substantially oxygen free.
7. The method of claim 1 , wherein (c) forming the oxide spacer deposition layer comprises one (1) to twenty (20) cycles, each cycle comprising:
a deposition phase including:
providing a flow of a deposition gas containing Si;
forming a plasma from the deposition gas; and
stopping the flow of the deposition gas; and
a treatment phase including:
providing a flow of a treatment gas containing at least one of O 2 or N 2 ;
forming a plasma from the treatment gas; and
stopping the flow of the treatment gas.
8. The method of claim 7 , wherein (d) partially removing further removes the bottom portion of the oxide spacer deposition layer formed on the bottom of the mask features.
9. The method of claim 8 , wherein the method is performed at a room temperature.
10. The method of claim 7 , wherein the deposition gas includes Silane and hydrocarbon.
11. The method of claim 7 , wherein the deposition gas includes SiH 4 and CH 3 F.
12. The method of claim 7 , wherein the deposition gas is substantially oxygen free.
13. The method of claim 1 , wherein (d) partially removing further removes the bottom portion of the oxide spacer deposition layer formed on the bottom of the mask features.
14. The method of claim 1 , wherein the method is performed at a room temperature.
15. A computer implemented method for etching an etch layer disposed over a substrate and below an antireflective coating (ARC) layer and a patterned organic mask with mask features, the method comprising:
(a) placing the substrate in a process chamber;
(b) opening the ARC layer through the mask features of the patterned mask;
(c) forming an oxide spacer deposition layer, the oxide spacer deposition layer including a top portion, side walls, and a bottom portion, the top portion covering a top of the organic mask, the side walls covering side walls of the organic mask, and the bottom portion covering a bottom of the mask features, which comprises one (1) to twenty (20) cycles, each cycle, comprising:
a deposition phase including:
providing a flow of a deposition gas containing Si;
forming a plasma from the deposition gas; and
stopping the flow of the deposition gas; and
a treatment phase including:
providing a flow of a treatment gas containing at least one of O 2 or N 2 ;
forming a plasma from the treatment gas; and
stopping the flow of the treatment gas;
(d) partially removing, by etching, the oxide spacer deposition layer on the organic mask, at least the top portion of the oxide spacer deposition layer being removed;
(e) removing, by etching, the organic mask and the ARC layer;
(f) etching the etch layer through the sidewalls of the oxide spacer deposition layer; and
(g) removing the substrate from the process chamber.
16. The computer implemented method of claim 15 , wherein the deposition gas includes SiH 4 and CH 3 F.
17. The computer implemented method of claim 15 , wherein the deposition gas is substantially oxygen free.
18. The method of claim 1 , wherein each step of the method is performed at a room temperature.