Image sensor module having a wafer level chip size package and method of manufacting the same and imaging device including the image sensor module and method of manufacturing the image device
An image sensor module and an imaging device. An image sensor package includes a plurality of image sensor chips for generating image signals and a lower transparent board over the image sensor chips. An upper transparent board is positioned over the lower transparent board and includes a lens for focusing an external light to the image sensor chips. An adhesion member is interposed between the upper transparent board and the lower transparent board, and thus the upper and lower transparent boards are adhered to each other by the adhesion member such that the lens and the image sensor chips are aligned with each other. A dehumidifying agent is arranged in the adhesion member to absorb moistures from an interior of the image sensor module. Accordingly, the moistures are prevented from being condensed onto the surface of the image sensor module.
1. An image sensor module comprising:
an image sensor package that includes a plurality of image sensor chips arranged on a substrate and a lower transparent board above the substrate;
an upper transparent board positioned over the lower transparent board and wherein the upper transparent board includes at least one lens formed therein to focus an external light on the plurality of image sensor chips;
a plurality of adhesion members interposed between the upper transparent board and the lower transparent board to adhere the upper and lower transparent boards to each other such that the at least one lens is entirely disposed within an area between the plurality of adhesion members; and
a dehumidifying agent arranged within each of the plurality of adhesion members to absorb moistures from an inside of the image sensor module.
2. The image sensor module of claim 1 , wherein the dehumidifying agent includes silicon resin.
3. The image sensor module of claim 2 , wherein the silicon resin includes a thermosetting resin having porous silica and dark pigments.
4. The image sensor module of claim 1 , wherein the image sensor package comprises:
a wafer level chip size package having at least one electrode pad connected to the image sensor chip;
at least one penetration electrode penetrating the substrate and making contact with the electrode pad; and
at least one external electrode electrically connected to the penetration electrode.
5. The image sensor module of claim 4 , wherein the image sensor package comprises:
a flip chip package in which the external electrode is positioned on a rear surface of the substrate opposite to the image sensor chips that are positioned on a front surface of the substrate.
6. The image sensor module of claim 1 , wherein the image sensor chip comprises:
one of a charge-coupled device (CCD) and a complementary metal-oxide semiconductor (CMOS) device.
7. An imaging device comprising:
an image sensor module that includes a lens for focusing an external light, a plurality of image sensor chips for generating image signals in response to the external light, and a plurality of dehumidifying agents for absorbing moistures from an inside of the image sensor module such that the lens is entirely disposed within an area defined by the plurality of dehumidifying agents;
a housing having a lens opening through which the lens is exposed, and a housing space for holding the image sensor module;
an upper transparent board positioned over the lower transparent board and wherein the upper transparent board includes at least one lens formed therein to focus an external light on the plurality of image sensor chips;
a plurality of adhesion members interposed between the upper transparent board and the lower transparent board to adhere the upper and lower transparent boards to each other such that the at least one lens is entirely disposed within an area between the plurality of adhesion members; and
a supplementary dehumidifying agent coated on an inner sidewall of the housing defining the housing space and absorbing moistures in the housing space of the housing.
8. The imaging device of claim 7 , wherein the housing is shaped as a open hollow box that includes a lens opening through which the lens of the image sensor module is exposed to surroundings, and a gate through which the image sensor module moves into/out-of the housing space.
9. The imaging device of claim 7 , wherein the housing includes one of thermoplastic resin, metal and compositions thereof.
10. An image sensor module, comprising:
a substrate that includes a first surface formed with a sensor chip and a second surface formed with an external electrode to transmit a signal from the sensor chip to an external device;
a supporting member formed with a lens assembly having a lens disposed over the sensor chip, the supporting member comprising:
a plurality of transparent boards, and
a plurality of adhesions disposed between adjacent transparent boards to provide space to accommodate a lens of the lens assembly such that the lens is entirely disposed within an area between the plurality of adhesions; and
a humidity control unit formed into the supporting member to control at least one of humidity and vapor in a space within the lens assembly, such that lens is disposed entirely within an area defined by the humidity control unit.
11. An image sensor module of claim 10 , wherein the humidity control unit is disposed within at least one of the plurality of adhesions, and has a portion exposed to the space.