Semiconductor device and method of manufacturing semiconductor device
An interconnect is provided in a first insulating layer and the upper surface of the interconnect is higher than the upper surface of the first insulating layer. An air gap is disposed between the interconnect and the first insulating layer. A second insulating layer is formed at least over the first insulating layer and the air gap. The second insulating layer does not cover the interconnect. An etching stopper film is formed at least over the second insulating layer. The etching stopper film is formed over the second insulating layer and the interconnect. A third insulating layer is formed over the etching stopper film. A via is provided in the third insulating layer so as to be connected to the interconnect.
1. A semiconductor device comprising:
a first insulating layer;
interconnects that are provided in said first insulating layer and have an upper surface which is higher than an upper surface of said first insulating layer;
air gaps that are provided between said interconnects and a sidewall of said first insulating layer in a direction perpendicular to the sidewall of the first insulating layer;
a second insulating layer that is formed at least over said first insulating layer and said air gaps;
an etching stopper film that is formed at least over said second insulating layer;
a third insulating layer that is formed over said etching stopper film; and
vias that are provided at least in said third insulating layer and are connected to said interconnects.
2. The semiconductor device as set forth in claim 1 , wherein said air gap is formed in said second insulating layer.
3. The semiconductor device as set forth in claim 1 , wherein said second insulating layer has a relative dielectric constant of equal to or less than 3.5.
4. The semiconductor device as set forth in claim 1 , wherein said upper surface of said interconnect is not covered with said second insulating layer, and
said etching stopper film is formed over said interconnect.
5. The semiconductor device as set forth in claim 1 , wherein said upper surface of said interconnect is covered with said second insulating layer, and
a lower part of said via is provided in said second insulating layer.
6. The semiconductor device as set forth in claim 1 , further comprising:
a metal cap film that is provided over said interconnects.
7. The semiconductor device as set forth in claim 1 , wherein said via is formed by a plating method.
8. The semiconductor device as set forth in claim 1 , wherein said first insulating layer is a SiCOH film, a SiCOHN film, or a porous film of said SiCOH film or said SiCOHN film.
9. The semiconductor device as set forth in claim 1 , wherein the etching stopper film is formed on the upper surface of the interconnects and an upper surface of the second insulating layer.
10. A semiconductor device comprising:
a first insulating layer;
interconnects that are provided in said first insulating layer and have an upper surface which is higher than an upper surface of said first insulating layer;
air gaps that are provided between said interconnects and said first insulating layer;
a second insulating layer that is formed at least over said first insulating layer and said air gaps;
an etching stopper film that is formed at least over said second insulating layer;
a third insulating layer that is formed over said etching stopper film; and
vias that are provided at least in said third insulating layer and are connected to said interconnects,
wherein the upper surface of the interconnects is co-planar with an upper surface of the second insulating layer.
11. The semiconductor device as set forth in claim 10 , wherein the vias are formed on the upper surface of the interconnects.
12. A semiconductor device comprising:
a first insulating layer;
interconnects that are provided in said first insulating layer and have an upper surface which is higher than an upper surface of said first insulating layer;
air gaps that are provided between said interconnects and said first insulating layer;
a second insulating layer that is formed at least over said first insulating layer and said air gaps;
an etching stopper film that is formed at least over said second insulating layer;
a third insulating layer that is formed over said etching stopper film; and
vias that are provided at least in said third insulating layer and are connected to said interconnects,
wherein the air gaps are formed in the second insulating layer such that the second insulating layer comprises an upper portion which is formed between the air gaps and the etching stopper film.
13. The semiconductor device as set forth in claim 12 , wherein the vias comprise a bottom edge portion which is formed on the upper portion of the second insulating layer at the upper surface of the interconnects.