IP Library › Granted Patent US 8,638,416
Granted Patent B2
US 8,638,416 · App. 12/766,373 · Granted Jan 28, 2014

Device manufacturing apparatus, including coolant temperature control, and method of manufacturing device

Inventor: Tomohiko Yoshida (Utsunomiya, JP)
Assignee: Canon Kabushiki Kaisha
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Quick Facts
Patent No.
US 8,638,416
App. No.
12/766,373
Granted
Jan 28, 2014
Kind
B2
Abstract

A device manufacturing apparatus includes a driving unit configured to perform driving for processing an object, a conduit through which a coolant that recovers heat generated by the driving unit flows, a cooler configure to cool the coolant that flows through the conduit, a heater configured to heat the coolant cooled by the cooler so that the driving unit cooled by the heated coolant has a target temperature, and a controller configured to heighten a target temperature of the coolant cooled by the cooler, if it is determined, based on control information to control the driving unit, that a heat amount to be generated by the driving unit decreases.

Claims (25)

1. A device manufacturing apparatus which includes a driving unit configured to perform driving for processing an object, a conduit through which a coolant that recovers heat generated by the driving unit flows, a cooler configured to cool the coolant that flows through the conduit, and a heater configured to heat the coolant cooled by the cooler so that the driving unit cooled by the heated coolant has a unit target temperature as a target temperature of the driving unit, the apparatus comprising:

a controller configured to heighten a cooler target temperature as a target temperature of the coolant downstream of the cooler and upstream of the heater, if it is determined, based on control information to control the driving unit, that a heat amount to be generated by the driving unit decreases.

2. An apparatus according to claim 1 , wherein the controller is configured to estimate the heat amount based on the control information and to set the cooler target temperature in accordance with the estimated heat amount.

3. An apparatus according to claim 1 , further comprising:

a temperature controller including a PID compensator configured to output a signal to control cooling by the cooler in accordance with a deviation between the cooler target temperature and a temperature of the coolant downstream of the cooler and upstream of the heater; and

an adder configured to add an offset to the signal output from the PID compensator based on the control information.

4. An apparatus according to claim 1 , wherein the apparatus has, as an operation mode thereof,

a first mode in which heating by the heater is stopped, and cooling by the cooler is controlled based on a deviation between a first cooler target temperature and a temperature of the driving unit, and

a second mode in which cooling by the cooler is controlled based on a deviation between a second cooler target temperature and a temperature of the coolant downstream of the cooler and upstream of the heater, and heating by the heater is controlled based on a deviation between the unit target temperature and a temperature of the driving unit,

wherein the first cooler target temperature is higher than the second cooler target temperature.

5. An apparatus according to claim 4 , wherein the controller is configured to select one of the first and second operation modes based on the control information.

6. An apparatus according to claim 4 , further comprising:

a console,

wherein the controller is configured to select one of the first and second operation modes in accordance with a command from the console.

7. An apparatus according to claim 1 , further comprising:

a console; and

a flow rate controller configured to control a flow rate of the coolant in accordance with a command from the console.

8. An apparatus according to claim 1 , wherein the apparatus is configured as an exposure apparatus that exposes a substrate to radiant energy.

9. A method of manufacturing a device, the method comprising:

exposing a substrate to radiant energy using a device manufacturing apparatus;

developing the exposed substrate; and

processing the developed substrate to manufacture the device,

wherein the device manufacturing apparatus includes a driving unit configured to perform driving for processing an object, a conduit through which a coolant that recovers heat generated by the driving unit flows, a cooler configure to cool the coolant that flows through the conduit, and a heater configured to heat the coolant cooled by the cooler so that the driving unit cooled by the heated coolant has a unit target temperature as a target temperature of the driving unit, the apparatus including:

a controller configured to heighten a cooler target temperature as a target temperature of the coolant downstream of the cooler and upstream of the heater, if it is determined, based on control information to control the driving unit, that a heat amount to be generated by the driving unit decreases,

wherein the apparatus is configured as an exposure apparatus that exposes a substrate to radiant energy.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2010
From: YOSHIDA, TOMOHIKO
To: CANON KABUSHIKI KAISHA
Reel/Frame 024648/0004 →
Priority Claims (1)
JP 2009-105607 · Apr 23, 2009 · national
Continuity (1)
Related Publication 20100273114A1 · Oct 28, 2010