Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cut
The present invention relates to structure and manufacture method for multi-row lead frame and semiconductor package, the method characterized by forming a pad portion on a metal material (first step); performing a surface plating process or organic material coating following the first pattern formation (second step); forming a second pattern on the metal material (third step); and packaging a semiconductor chip following the second pattern formation (fourth step), whereby an under-cut phenomenon is minimized by applying a gradual etching.
1. A lead frame that is a vertical lead-shaped lead frame for mounting an active element, the lead frame characterized by:
a metal material formed with a pad portion which becomes a vertical lead in the device mounting process; and
a pattern layer formed by electrolyte or non-electrolyte plating on the pad portion,
wherein the pattern layer is configured in such a way that an undercut length is formed smaller than an etched depth of the lower metal material, and
wherein a lower surface of the pattern layer in which the undercut is formed is exposed.
2. A lead frame for mounting an active element, characterized by:
a metal material formed with a pad portion which becomes a lead in the element mounting process; and
a pattern layer formed on the pad portion by electrolyte or non-electrolyte plating, where an alignment bias formed by a central point of the pattern layer and that of the pad portion is less than 38.67 μm,
wherein an undercut length of the pattern layer is formed smaller than an etched depth of the metal material, and
wherein a lower surface of the pattern layer in which the undercut is formed is exposed.
3. The lead frame of claim 2 , where a ratio of the alignment bias to pattern width is less than 0.11.