IP Library Granted Patent US 8,707,893
Granted Patent B2
US 8,707,893 · App. 13/300,114 · Granted Apr 29, 2014

Substrate treatment system, substrate treatment method, and non-transitory computer storage medium

Inventors: Masatoshi Deguchi (Kumamoto, JP); Hideo Funakoshi (Koshi, JP); Toshichika Takei (Koshi, JP); Norifumi Sato (Koshi, JP); Wataru Kiyota (Koshi, JP); Daisuke Ishimaru (Koshi, JP); Shinichi Machidori (Koshi, JP); Ikuo Sunaka (Koshi, JP); Shigenori Kamei (Koshi, JP)
Assignee: Tokyo Electron Limited
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Quick Facts
Patent No.
US 8,707,893
App. No.
13/300,114
Granted
Apr 29, 2014
Kind
B2
Abstract

A substrate treatment system includes a plurality of treatment apparatuses, a position adjustment apparatus adjusting a center position of the substrate, a substrate transfer apparatus transferring the substrate to the treatment apparatuses and the position adjustment apparatus, and a control unit controlling operations of the apparatuses. The substrate transfer apparatus includes an arm part curved along a peripheral edge portion of the substrate with a radius of curvature larger than a radius of the substrate, and a holding part projecting inward from the arm part and holding a rear surface of the substrate. The position adjustment apparatus includes a mounting table which holds a central portion of the rear surface of the substrate and is rotatable and horizontally movable. The control unit controls the mounting table such that the center position of the substrate held on the mounting table is aligned with a center position of the arm part.

Claims (78)

1. A substrate treatment system comprising

a plurality of treatment apparatuses treating a substrate,

a position adjustment apparatus adjusting a center position of the substrate,

a substrate transfer apparatus transferring the substrate to said treatment apparatuses and said position adjustment apparatus, and

a control unit controlling operations of said apparatuses,

said substrate transfer apparatus comprising

an arm part curved along a peripheral edge portion of the substrate with a radius of curvature larger than a radius of the substrate, and

a holding part projecting inward from said arm part and holding a rear surface of the substrate, without contacting a side surface of the substrate,

said position adjustment apparatus comprising

a mounting table which holds a central portion of the rear surface of the substrate and is rotatable and horizontally movable,

wherein said control unit is configured to control said mounting table to rotate and horizontally move such that the center position of the substrate held on said mounting table is aligned with a center position of said arm part.

2. The substrate treatment system as set forth in claim 1 ,

wherein said position adjustment apparatus comprises a position detection unit detecting the center position of the substrate held on said mounting table and a moving mechanism moving said mounting table, and

wherein said moving mechanism turns said mounting table around a vertical axis and moves said mounting table in one direction being a horizontal direction based on a detection result of the center position of the substrate by said position detection unit.

3. The substrate treatment system as set forth in claim 1 ,

wherein said holding part holds the substrate by a friction force between said holding part and the substrate.

4. The substrate treatment system as set forth in claim 1 ,

wherein said holding part has a suction port formed at a tip portion thereof and connected to a vacuum pump, and

wherein said holding part holds the substrate by suction from said suction port.

5. The substrate treatment system as set forth in claim 1 ,

wherein said plurality of treatment apparatuses include a coating treatment apparatus applying a coating solution onto the substrate whose center position has been adjusted in said position adjustment apparatus.

6. The substrate treatment system as set forth in claim 5 ,

wherein the coating solution is a polyimide solution.

7. The substrate treatment system as set forth in claim 5 , further comprising:

a treatment block in which said treatment apparatuses including said coating treatment apparatus are stacked in multiple tiers in a vertical direction;

another treatment block in which said position adjustment apparatus and another treatment apparatus are stacked in multiple tiers in the vertical direction; and

another substrate transfer apparatus transferring the substrate to said position adjustment apparatus and said another treatment apparatus in said another treatment block,

wherein said another substrate transfer apparatus comprises another arm part curved along the peripheral edge portion of the substrate with a radius of curvature larger than the radius of the substrate, and another holding part projecting inward from said another arm part and holding the rear surface of the substrate.

8. The substrate treatment system as set forth in claim 7 ,

wherein said another holding part holds the substrate by a friction force between said another holding part and the substrate.

9. The substrate treatment system as set forth in claim 7 ,

wherein said another holding part has a suction port formed at a tip portion thereof and connected to a vacuum pump, and

wherein said another holding part holds the substrate by suction from said suction port.

10. The substrate treatment system as set forth in claim 5 ,

wherein said plurality of treatment apparatuses include:

a temperature regulation apparatus regulating a temperature of the substrate,

a thermal treatment apparatus performing thermal treatment on the substrate on which the coating solution has been applied in said coating treatment apparatus, to form a coating film on the substrate, and

a peripheral edge portion cleaning apparatus cleaning and removing the coating film on the peripheral edge portion of the substrate formed in said thermal treatment apparatus,

wherein said substrate transfer apparatus transfers the substrate to said temperature regulation apparatus, said thermal treatment apparatus, and said peripheral edge portion cleaning apparatus.

11. A substrate treatment method using a substrate treatment system, the substrate treatment system comprising a plurality of treatment apparatuses treating a substrate, a position adjustment apparatus adjusting a center position of the substrate, and a substrate transfer apparatus transferring the substrate to the treatment apparatuses and the position adjustment apparatus,

the substrate transfer apparatus comprising an arm part curved along a peripheral edge portion of the substrate with a radius of curvature larger than a radius of the substrate, and a holding part projecting inward from the arm part and holding a rear surface of the substrate,

the position adjustment apparatus comprising a mounting table which holds a central portion of the rear surface of the substrate and is rotatable and horizontally movable,

said substrate treatment method comprising:

a position adjustment step of rotating and horizontally moving the mounting table such that the center position of the substrate held on the mounting table is aligned with a center position of the arm part in the position adjustment apparatus; and

a transfer step of then transferring the substrate out of the position adjustment apparatus using the substrate transfer apparatus with the peripheral edge portion of the substrate not in contact with the arm part.

12. The substrate treatment method as set forth in claim 11 ,

wherein the position adjustment apparatus comprises a position detection unit detecting the center position of the substrate held on the mounting table and a moving mechanism moving the mounting table, and

wherein said position adjustment step comprises the steps of:

detecting the center position of the substrate by the position detection unit; and

turning the mounting table around a vertical axis and moving the mounting table in one direction being a horizontal direction by the moving mechanism based on a result of the position detection.

13. The substrate treatment method as set forth in claim 11 ,

wherein the plurality of treatment apparatuses include a coating treatment apparatus comprising another mounting table holding and rotating the central portion of the rear surface of the substrate and a coating solution nozzle supplying the coating solution onto the substrate held on the another mounting table, and

wherein after said transfer step, the substrate is delivered between the arm part and the another mounting table such that the center position of the substrate held by the arm part is aligned with a center position of the another mounting table.

14. The substrate treatment method as set forth in claim 13 ,

wherein the coating solution is a polyimide solution.

15. The substrate treatment method as set forth in claim 11 ,

wherein the holding part holds the substrate by a friction force between the holding part and the substrate.

16. The substrate treatment method as set forth in claim 11 ,

wherein the holding part has a suction port formed at a tip portion thereof and connected to a vacuum pump, and

wherein the holding part holds the substrate by suction from the suction port.

17. The substrate treatment method as set forth in claim 13 ,

wherein the plurality of treatment apparatuses include:

a temperature regulation apparatus regulating a temperature of the substrate,

a thermal treatment apparatus performing thermal treatment on the substrate on which the coating solution has been applied in the coating treatment apparatus, to form a coating film on the substrate, and

a peripheral edge portion cleaning apparatus cleaning and removing the coating film on the peripheral edge portion of the substrate formed in the thermal treatment apparatus,

wherein said substrate treatment method comprises:

a first temperature regulation step of regulating a temperature of the substrate to a predetermined temperature in the temperature regulation apparatus, before said position adjustment step;

a thermal treatment step of performing thermal treatment on the substrate after applying the coating solution onto the substrate in the coating treatment apparatus, to form the coating film on the substrate in the thermal treatment apparatus;

a second temperature regulation step of regulating the temperature of the substrate to a predetermined temperature in the temperature regulation apparatus, after said thermal treatment step;

another position adjustment step of adjusting the center position of the substrate in the position adjustment apparatus, after said second temperature regulation step; and

a peripheral edge portion cleaning step of cleaning and removing the coating film on the peripheral edge portion of the substrate in the peripheral edge portion cleaning apparatus, after said another position adjustment step,

wherein transfer of the substrate to the temperature regulation apparatus, the thermal treatment apparatuses, and the peripheral edge portion cleaning apparatus is performed using the substrate transfer apparatus with the peripheral edge portion of the substrate not in contact with the arm part.

18. The substrate treatment system as set forth in claim 1 ,

wherein said plurality of treatment apparatuses include a waste liquid recovery apparatus disposed below said coating treatment apparatus, and recovering a waste liquid drained from said coating treatment apparatus, and

wherein said waste liquid recovery apparatus comprises

a recovery tank recovering the waste liquid from said coating treatment apparatus,

a vertical pipe provided to extend vertically downward from said coating treatment apparatus, and

an inclined pipe provided to extend from an end portion of said vertical pipe to said recovery tank inclined at a predetermined angle.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 18, 2011
From: DEGUCHI, MASATOSHI; FUNAKOSHI, HIDEO; TAKEI, TOSHICHIKA; SATO, NORIFUMI; KIYOTA, WATARU; ISHIMARU, DAISUKE; MACHIDORI, SHINICHI; SUNAKA, IKUO; KAMEI, SHIGENORI
To: TOKYO ELECTRON LIMITED
Reel/Frame 027254/0926 →
Priority Claims (1)
JP 2010-265257 · Nov 29, 2010 · national
Continuity (1)
Related Publication 20120135148A1 · May 31, 2012