Multi-chip package with a supporting member and method of manufacturing the same
A multi-chip package may include a package substrate, a first semiconductor chip, a second semiconductor chip and a supporting member. The first semiconductor chip may be arranged on an upper surface of the package substrate. The first semiconductor chip may be electrically connected with the package substrate. The second semiconductor chip may be arranged on an upper surface of the first semiconductor chip. The second semiconductor chip may be electrically connected with the first semiconductor chip. The second semiconductor chip may have a protrusion overhanging an area beyond a side surface of the first semiconductor chip. The supporting member may be interposed between the protrusion of the second semiconductor chip and the package substrate to prevent a deflection of the protrusion.
1. A multi-chip package comprising:
a package substrate;
a first semiconductor chip arranged on an upper surface of the package substrate and electrically connected with the package substrate;
a second semiconductor chip arranged on an upper surface of the first semiconductor chip and electrically connected with the package substrate, the second semiconductor chip having a protrusion overhanging an area beyond a side surface of the first semiconductor chip;
a supporting member interposed between the protrusion of the second semiconductor chip and the package substrate to prevent a deflection of the protrusion; and
an auxiliary bonding pad extending from the first bonding pad along an upper surface of the supporting member, the first conductive wire connected to the auxiliary bonding pad.
2. The multi-chip package of claim 1 , wherein the supporting member has a width substantially the same as that of the protrusion.
3. The multi-chip package of claim 1 , wherein the supporting member has a width narrower than that of the protrusion.
4. The multi-chip package of claim 3 , wherein the width of the supporting member is no less than about 50% of the width of the protrusion.
5. The multi-chip package of claim 1 , wherein the first semiconductor chip and the second semiconductor chip are stacked crosswise of each other.
6. The multi-chip package of claim 5 , wherein the first semiconductor chip has a first long side and a first short side, and the second semiconductor chip has a second long side having a length substantially the same as that of the first long side and a second short side having a length substantially the same as that of the first short side.
7. The multi-chip package of claim 5 , wherein the first semiconductor chip has a first long side and a first short side, and the second semiconductor chip has a second long side having a length longer than that of the first long side and a second short side having a length substantially the same as that of the first short side.
8. The multi-chip package of claim 1 , further comprising:
a first conductive wire electrically connected between a first bonding pad of the first semiconductor chip and the package substrate; and
a second conductive wire electrically connected between a second bonding pad of the second semiconductor chip and the package substrate.
9. The multi-chip package of claim 1 , further comprising:
a molding member formed on the upper surface of the package substrate to cover the first semiconductor chip and the second semiconductor chip.
10. The multi-chip package of claim 1 , wherein the supporting member has an upper surface in contact with a lower surface of the protrusion, a lower surface in contact with an upper surface of the package substrate, an inner side surface in contact with the side surface of the first semiconductor chip, and an outer side surface in contact with the molding member.
11. The multi-chip package of claim 1 , wherein an inner side surface of the supporting member is spaced apart from the side of the first semiconductor chip.
12. The multi-chip package of claim 1 , wherein an outer side surface of the supporting member is substantially coplanar with an outer side surface of the protrusion.