Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads
A method of manufacturing a semiconductor package includes embedding a semiconductor chip in an encapsulant. First contact pads are formed on a first main face of the semiconductor package and second contact pads are formed on a second main face of the semiconductor package opposite the first main face. A diameter d in micrometers of an exposed contact pad area of the second contact pads satisfies d≧(8/25)x+142 μm, where x is a pitch of the second contact pads in micrometers.
1. A method of manufacturing a semiconductor package, the method comprising:
embedding a semiconductor chip in an encapsulant;
forming first contact pads on a first main face of the semiconductor package; and
forming second contact pads on a second main face of the semiconductor package opposite the first main face, wherein a diameter d in micrometers of an exposed contact pad area of the second contact pads satisfies d≧(8/25)x+142 μm, wherein x is a pitch of the second contact pads in micrometers.
2. The method of claim 1 , further comprising bonding the first contact pads to a board.
3. The method of claim 1 , further comprising bonding the second contact pads to another semiconductor package.
4. The method of claim 3 , wherein the semiconductor chip comprises a logic circuit, a power circuit or an optical circuit.
5. The method of claim 4 , wherein the another semiconductor package comprises a memory chip.
6. The method of claim 3 , wherein a spacing between the second main face of the semiconductor package and the another semiconductor package has a dimension that varies by more than eight micrometers across a lateral extension of the spacing.
7. The method of claim 3 , wherein a main face of the another semiconductor package facing the semiconductor package has a warpage height of at least eight micrometers across a lateral extension of the main face.
8. The method of claim 3 , wherein the second main face of the semiconductor package has a warpage height of at least eight micrometers across a lateral extension of the second main face.
9. The method of claim 1 , wherein the exposed contact pad area of the second contact pads is defined by an opening in a solder mask layer overlying a metal layer forming the second contact pads.
10. The method of claim 1 , wherein the exposed contact pad area of the second contact pads is defined by lateral dimensions of a metal layer forming the second contact pads.
11. The method of claim 1 , wherein the diameter d in micrometers satisfies d≦(8/25)x+172 μm.
12. The method of claim 1 , wherein the pitch is x=400 micrometers and the diameter is d≧260 micrometers.
13. The method of claim 1 , wherein the pitch is x=500 micrometers and the diameter is d≧300 micrometers.
14. The method of claim 1 , wherein the pitch is x=650 micrometers and the diameter is d≧340 micrometers.
15. The method of claim 1 , further comprising:
an element having a conductive via, the conductive via extending from the first main face of the semiconductor package to a metal layer forming the second contact pads.
16. The method of claim 15 , wherein the element is made of an insulating material.
17. A method of manufacturing a semiconductor package, the method comprising:
placing a plurality of semiconductor chips on a carrier;
covering the semiconductor chips with a molding material to form an encapsulant;
removing the carrier from the semiconductor chips;
forming a number of contact pads on a surface of the encapsulant facing away from the surface of the encapsulant which is defined by the carrier, a diameter d in micrometers of an exposed area of each contact pad satisfying d≧(8/25)x+142 μm, wherein x is a pitch of the contact pads in micrometers; and
singulating the semiconductor chips.
18. The method of claim 17 , further comprising:
placing at least one element having a conductive via next to at least one of the semiconductor chips.
19. The method of claim 17 , wherein the diameter d in micrometers satisfies d≦(8/25)x+172 μm.
20. The method of claim 17 , wherein the pitch is x=400 micrometers and the diameter is d≧260 micrometers.
21. The method of claim 17 , wherein the pitch is x=500 micrometers and the diameter is d≧300 micrometers.
22. The method of claim 17 , wherein the pitch is x=650 micrometers and the diameter is d≧340 micrometers.
23. A method of manufacturing a package-on-package device, the method comprising:
providing a mounting platform;
placing a first semiconductor package comprising a first semiconductor chip, an encapsulant embedding the first semiconductor chip, first contact pads on a first main face of the first semiconductor package and second contact pads on a second main face of the first semiconductor package opposite to the first main face on the mounting platform;
placing a second semiconductor package comprising a second semiconductor chip, an encapsulant embedding the second semiconductor chip and third contact pads on a first main face of the second semiconductor package on the first semiconductor package, wherein the first main face of the second semiconductor package faces the second main face of the first semiconductor package; and
reflow soldering to electrically connect the second contact pads to the third contact pads and the first contact pads to the mounting platform,
wherein a diameter d in micrometers of an exposed contact pad area of the second contact pads satisfies d≧(8/25)x+142 μm, wherein x is a pitch of the second contact pads in micrometers.
24. The method of claim 23 , wherein the semiconductor chip comprises a logic circuit, a power circuit or an optical circuit and wherein the second semiconductor package comprises a memory chip.
25. The method of claim 23 , wherein a spacing between the second main face of the first semiconductor package and the first main face of the second semiconductor package has a dimension that varies by more than eight micrometers across a lateral extension of the spacing.