Element array with a plurality of electromechanical conversion devices
An element array comprises a plurality of elements having a first electrode and a second electrode with a gap therebetween; the first electrode is separated for each of the elements by grooves, an insulating connection substrate is bonded to the first electrode, and wirings are provided from the respective first electrodes through the connection substrate to the side opposite to the first electrodes.
1. An electromechanical conversion device comprising:
an element substrate including a plurality of elements, each of said elements having a first electrode, a second electrode, and a support disposed on said first electrode so as to interpose a gap between said first electrode and said second electrode;
a circuit substrate; and
an insulating connection substrate configured to fix said element substrate and said circuit substrate, said connection substrate being provided with wiring,
wherein said first electrode and said circuit substrate are connected electrically by said wiring.
2. The electromechanical conversion device according to claim 1 , further comprising:
a membrane supported by said support,
wherein said second electrode is disposed on said membrane.
3. The electromechanical conversion device according to claim 2 , wherein said support and said membrane are disposed on said first electrode, and a groove separates respective ones of said first electrodes of each of said elements.
4. The electromechanical conversion device according to claim 3 , wherein said groove is shut by said connection substrate where said first electrodes and said connection substrate are bonded together.
5. The electromechanical conversion device according to claim 1 , wherein said connection substrate has a thickness that is in a range from 50 μm to 1000 μm.
6. The electromechanical conversion device according to claim 1 , wherein said connection substrate has through-holes for said wiring.
7. The electromechanical conversion device according to claim 6 , wherein said first electrodes are formed one-to-one for said through-holes.
8. The electromechanical conversion device according to claim 6 , wherein said through-holes expand from said first face of said connection substrate toward a second face that is opposite from said first face.
9. The electromechanical conversion device according to claim 1 , wherein said wiring and said first electrode are not coaxial.
10. The electromechanical conversion device according to claim 1 , wherein said first electrodes are formed from a semiconductor material.
11. An electromechanical conversion device comprising:
a plurality of electromechanical conversion elements, each of said electromechanical conversion elements having a first electrode and a second electrode disposed above said first electrode so as to interpose a gap between said first electrode and said second electrode;
a circuit substrate; and
a connection substrate configured to fix said electromechanical conversion element and said circuit substrate, said connection substrate being provided with a plurality of wirings,
wherein said first electrodes of said elements and said circuit substrate are connected electrically by said wirings.
12. An electromechanical conversion device comprising:
a plurality of electromechanical conversion elements, each of said electromechanical conversion elements having a first electrode and a second electrode disposed above said first electrode so as to interpose a gap between said first electrode and said second electrode;
a circuit substrate; and
a connection substrate configured to fix said electromechanical conversion element and said circuit substrate, said connection substrate being provided with a plurality of wirings and a plurality of through-holes, and each of said through-holes having one of said wirings therein,
wherein said first electrodes of said elements and said circuit substrate are connected electrically by said wirings.
13. The electromechanical conversion device according to claim 12 , further comprising:
a support; and
a membrane supported by said support, on which said second electrode is disposed.
14. The electromechanical conversion device according to claim 12 , wherein said first electrodes of said electromechanical conversion elements are isolated from each other.
15. The electromechanical conversion device according to claim 12 , wherein said connection substrate has a thickness that is in a range from 50 μm to 1000 μm.
16. The electromechanical conversion device according to claim 12 , wherein a common electrode includes said second electrodes.
17. The electromechanical conversion device according to claim 12 , wherein said wiring and said first electrode of a given one of said elements are not coaxial.
18. The electromechanical conversion device according to claim 12 , wherein at least one groove separates said first electrodes, said groove being shut by said connection substrate where said first electrodes and said connection substrate are bonded together.
19. The electromechanical conversion device according to claim 12 , wherein said first electrodes are formed from a semiconductor material.