Method for bonding thin film piece
A method for bonding a thin film piece includes: forming a support layer on each upper face of a plurality of thin film pieces; fixing the plurality of thin film pieces to a first substrate through a temporary fixing layer provided on a lower face of the first substrate so that the temporary fixing layer contacts with the upper face and at least a part of a side face of each support layer; bonding a lower face of the plurality of thin film pieces to a second substrate; and removing the first substrate from the plurality of thin film pieces by removing at least one of the support layer and the temporary fixing layer.
1. A method for bonding a thin film piece comprising:
forming a support layer on each upper face of a plurality of thin film pieces;
fixing the plurality of thin film pieces to a first substrate through a temporary fixing layer provided on a lower face of the first substrate so that the temporary fixing layer contacts with the upper face and at least a part of a side face of each support layer;
bonding a lower face of the plurality of thin film pieces to a second substrate; and
removing the first substrate from the plurality of thin film pieces by removing at least one of the support layer and the temporary fixing layer.
2. The method as claimed in claim 1 , wherein a thickness of at least one of the plurality of thin film pieces is different from a thickness of other thin film pieces.
3. The method as claimed in claim 1 further comprising arranging the plurality of thin film pieces on a third substrate before fixing the plurality of thin film pieces to the first substrate through the temporary fixing layer.
4. The method as claimed in claim 3 wherein an upper face of the third substrate having a plurality of areas, at least one of the areas in the upper face of the third substrate having a height of surface different from the other area.
5. The method as claimed in claim 4 wherein an upper face of the second substrate having a plurality of areas, a height of a surface of each area of the second substrate corresponding to the height of the surface of each area of the third substrate.
6. The method as claimed in claim 3 , wherein the plurality of thin film pieces are fixed to the third substrate by a vacuum adsorption or an electrostatic adsorption.
7. The method as claimed in claim 1 , wherein the forming of the support layer comprises:
applying a coated layer on the plurality of thin film pieces arranged on a fourth substrate;
forming a first support layer by patterning the coated layer to form a pattern of the first support layer that covers at least one of the plurality of thin film pieces; and
forming a second support layer on the first support layer, the second support layer having viscosity higher than that of the coated layer.
8. The method as claimed in claim 7 , wherein at least one of the plurality of thin film pieces has an overhang portion on its surface.
9. The method as claimed in claim 1 , wherein the second substrate is comprised of SiC.
10. The method as claimed in claim 1 , wherein the bonding of the lower face of the plurality of thin film pieces to the second substrate is using a surface activation bonding method.
11. The method as claimed in claim 1 , wherein the temporary fixing layer is comprised by an ultraviolet cure adhesive medium.
12. The method as claimed in claim 1 , wherein the first substrate is comprised by sapphire.