Packages including active dies and dummy dies and methods for forming the same
A device includes a bottom chip and an active top die bonded to the bottom chip. A dummy die is attached to the bottom chip. The dummy die is electrically insulated from the bottom chip.
1. A device comprising:
a bottom chip;
an active top die bonded to the bottom chip;
a dummy die attached to the bottom chip, wherein the dummy die is electrically insulated from the bottom chip, wherein the dummy die is selected from the group consisting essentially of a blank die free from integrated circuits therein, a silicon die free from low-k dielectric layers, metal lines, and vias therein, a die comprising integrated circuits that are disconnected from the active top die and the bottom chip, and combinations thereof; and
a molding compound in a gap between the active top die and the dummy die.
2. The device of claim 1 , wherein the dummy die is configured not to be coupled to power supply.
3. The device of claim 1 , wherein the active top die is bonded to the bottom chip and electrically coupled to the bottom chip through electrical connectors, wherein the dummy die is adhered to the bottom chip through an adhesive, and wherein the dummy die is electrically insulated from the bottom chip by the adhesive.
4. The device of claim 1 , wherein the active top die and the dummy die are molded in the molding compound.
5. The device of claim 1 , wherein the bottom chip is a part of a wafer, and is not sawed from the wafer.
6. The device of claim 1 , wherein the bottom chip further comprises a through-substrate via in a semiconductor substrate of the bottom chip.
7. A device comprising:
a bottom chip comprising:
a substrate;
a through-via extending from a first side to a second side of the substrate;
a first connector on the first side of the substrate; and
a second connector on the second side of the substrate, wherein the first connector is electrically coupled to the second connector through the through via;
an active top die on the first side of the substrate and bonded to the bottom chip through the first connector;
a dummy die on the first side of the substrate, wherein the dummy die is selected from the group consisting essentially of a blank die free from integrated circuits therein, and a silicon die free from low-k dielectric layers, metal lines, and vias; and
a die-attach film attaching the dummy die to the bottom chip.
8. The device of claim 7 , wherein the dummy die is configured not to be coupled to any power supply.
9. The device of claim 8 , wherein the die-attach film comprises a dielectric material, and wherein no conductive feature penetrates through the die-attach film.
10. The device of claim 7 further comprising a molding compound in a gap between the active top die and the dummy die.
11. The device of claim 7 , wherein the dummy die does not comprise active integrated circuits therein.
12. The device of claim 7 , wherein the dummy die is a blank die not comprising any integrated circuit therein.
13. The device of claim 7 , wherein the dummy die is a part a wafer, and is not sawed from the wafer.
14. The device of claim 7 , wherein the dummy die comprises integrated circuits therein, with the integrated circuits in the dummy die disconnected from the top active die and the bottom chip.