Semiconductor constructions
The invention includes semiconductor constructions containing optically saturable absorption layers. An optically saturable absorption layer can be between photoresist and a topography, with the topography having two or more surfaces of differing reflectivity relative to one another. The invention also includes methods of patterning photoresist in which a saturable absorption layer is provided between the photoresist and a topography with surfaces of differing reflectivity, and in which the differences in reflectivity are utilized to enhance the accuracy with which an image is photolithographically formed in the photoresist.
1. A semiconductor construction, comprising:
a semiconductor substrate;
in at least one cross-sectional view, spaced projections over the substrate, the spaced projections being spaced from one another by an intervening region;
a first layer over the spaced projections and over the intervening region between the spaced projections, at least one of the following two uppermost surfaces terminating at a bottommost surface of the first layer: an uppermost surface of respective space projections and an uppermost surface of an intervening region;
an optically saturable absorption layer over the first layer;
photoresist over the optically saturable absorption layer; and
wherein the spaced projections correspond to an upwardly-opening container structure, and wherein the intervening region comprises insulative material within the container structure.
2. The construction of claim 1 wherein the spaced projections comprise conductively-doped silicon capped with metal silicide.
3. The construction of claim 1 wherein the spaced projections correspond to pedestals, and wherein the intervening region comprises a transistor gate stack.
4. The construction of claim 1 wherein the optically saturable absorption layer comprises a plurality of optically saturable absorption layers.
5. The construction of claim 1 further comprising a source/drain for a transistor, the source/drain in contact with one of the spaced projections.
6. The construction of claim 1 further comprising a capacitor storage node in contact with at least one of the following: the spaced projections, the first layer and material in the intervening region.
7. A semiconductor construction, comprising:
a semiconductor substrate;
in at least one cross-sectional view, spaced projections over the substrate, the spaced projections being spaced from one another by an intervening region;
a first layer over the spaced projections and over the intervening region between the spaced projections;
an optically saturable absorption layer over the first layer;
photoresist over the optically saturable absorption layer;
a capacitor storage node in contact with one of the spaced projections; and
wherein the capacitor storage node is located only in material in the intervening region.
8. The construction of claim 7 wherein the capacitor storage node is further in contact with at least one of the following: the first layer and material in the intervening region.
9. The construction of claim 8 wherein the capacitor storage node is further in contact with both of the first layer and the material in the intervening region.
10. A semiconductor construction, comprising:
a semiconductor substrate;
in at least one cross-sectional view, spaced projections over the substrate, the spaced projections being spaced from one another by an intervening region;
a first layer over the spaced projections and over the intervening region between the spaced projections;
an optically saturable absorption layer over the first layer;
photoresist over the optically saturable absorption layer; and
an opening for a capacitor storage node, the opening extends through at least two of the following: material in the intervening region, the first layer, the optically saturable absorption layer and the photoresist.
11. The construction of claim 10 further comprising capacitor storage node material in only the material of the intervening region.
12. The construction of claim 10 wherein the opening extends into at least three of the following: the material of the intervening region, the first layer, the optically saturable absorption layer and the photoresist.
13. The construction of claim 10 further comprising capacitor storage node material in contact with one of the spaced projections and wherein the opening is over the capacitor storage node material.