Pillar-based interconnects for magnetoresistive random access memory

1. A method for fabricating a magnetic tunnel junctions (“MTJ”) device, the method comprising:

forming a metal layer over a substrate layer and an M2 patterned area of the substrate layer, wherein the M2 patterned area comprises a conductive material;

forming a hard mask layer over the metal layer;

subtractively patterning the metal layer and the hard mask layer creating a via level (“VA”) pillar structure comprising a portion of the metal layer and a portion of the hard mask layer that have been subtractively patterned;

forming an oxide layer over the substrate layer and the VA pillar structure;

polishing the oxide layer below a top surface of the hard mask layer of the VA pillar structure and above the metal layer of the VA pillar structure;

after the polishing, stripping away the hard mask layer of the VA pillar structure leaving the portion of the metal layer of the VA pillar structure such that a sublithographic contact comprising the portion of the metal layer is formed;

forming, subsequent to polishing the oxide layer, a MTJ stack on the oxide layer and the metal layer of the VA pillar structure, where the MTJ stack is in contact with the metal layer of the VA pillar structure; and

etching the MTJ stack down to the oxide layer that has been polished to dimension a size of the MTJ stack and a shape anisotropy of the MTJ stack independent of a size and a shape anisotropy of the sublithographic contact, wherein at least a portion of a bottom layer of the MTJ stack directly contacts a top surface of the oxide layer.

2. The method of claim 1 , wherein the metal layer comprises tantalum nitride.

3. The method of claim 1 , wherein etching the MTJ stack results in forming a non-circular configuration of the MTJ stack.

4. The method of claim 1 , wherein subtractively patterning the metal layer results in forming a non-circular configuration of the metal layer.

5. The method of claim 1 , further comprising:

dimensioning the MTJ stack and the sublithographic contact to be the same width.

6. The method of claim 1 , further comprising:

dimensioning the sublithographic contact to have a larger width than the MTJ stack.

7. The method of claim 1 , further comprising:

forming the sublithographic contact and the MTJ stack 90 degrees relative to each other.

8. The method of claim 1 , further comprising:

dimensioning the MTJ stack to have a larger width than the sublithographic contact.