Ultra-wideband assembly system and method

1. An ultra-wideband assembly in an electric circuit having a circuit board having a transmission line, comprising:

a non-conductive tapered core having a conductive wire wound on an outer surface of said non-conductive tapered core, said conductive wire having a proximate end and a distal end;

a low-frequency inductor coupled to said non-conductive tapered core via said distal end of said conductive wire and configured to allow mounting of said non-conductive tapered core at an angle with respect to the circuit board;

said low frequency inductor is being disposed on a dielectric board configured to be coupled to said circuit board;

an ultra-wideband capacitor coupled to said non-conductive tapered core via said proximate end of said conductive wire;

said ultra-wideband capacitor being coupled to said dielectric board and to the transmission line.

2. The assembly according to claim 1 , further comprising

a damping resistor being coupled to said low frequency inductor;

an isolating resistor being coupled to said low frequency inductor; and

wherein said damping resistor is configured to dampen resonant responses within said low frequency inductor;

wherein said isolating resistor is configured to dampen potential interactions with a network and an electric DC feed line of said network being coupled to the assembly.

3. The assembly according to claim 2 , wherein

said damping resistor has a value of greater than 180 Ohms; and

said isolating resistor has a value in a range of 0 Ohms to 100 Ohms.

4. The assembly according to claim 2 , further comprising

a bypass capacitor configured to bypass RF energy signals that manage to leak through said low frequency inductor and said non-conductive tapered core.

5. The assembly according to claim 4 , further comprising

a protective cover coupled to said low-frequency inductor and configured to protect components of said assembly.

6. The assembly according to claim 5 , wherein said non-conductive tapered core further comprises

a distal end; and

a proximate end; and

said distal end being larger than proximate end.

7. The assembly according to claim 6 , wherein said non-conductive tapered core has a tetrahedron shape.

8. The assembly according to claim 6 , wherein said non-conductive tapered core has a triangular pyramid shape.

9. The assembly according to claim 6 , wherein said non-conductive tapered core has a multi-dimensional polygonal shape.

10. The assembly according to claim 6 , wherein said non-conductive tapered core is composed of powdered iron.

11. The assembly according to claim 6 , further comprising a dielectric disposed at said proximate end of said non-conductive tapered core.

12. The assembly according to claim 11 , wherein said dielectric disposed along at least one tapering side of said non-conductive tapered core.

13. The assembly according to claim 6 , wherein a surface area of said distal end is approximately equal to 0.0041 square inches.

14. The assembly according to claim 6 , wherein a surface area of said proximate end is in a range from 0 square inches to 0.000025 square inches.

15. The assembly according to claim 6 , wherein said tapered conductive core has a tapering angle, wherein said tapering angle is in a range of less than 10 degrees to greater than 25 degrees.

16. The assembly according to claim 6 , wherein the assembly is configured to reduce insertion loss in a frequency range from below 10 KHz to over 100 GHz.

17. The assembly according to claim 6 , wherein said proximate end of said conductive wire extends in a range from approximately 0 inches to approximately 0.010 inches away from said proximate end of said non-conductive tapered core.

18. The assembly according to claim 6 , further comprising another dielectric layer being disposed on top of at least a portion of said conductive wire being wound on said non-conductive tapered core, said dielectric layer being disposed substantially near said proximate end of said non-conductive tapered core.

19. The assembly according to claim 18 , further comprising a metal pad coupled to said dielectric layer at said proximate end of said non-conductive tapered core.

20. The assembly according to claim 19 , wherein said dielectric layer is configured to extend away from said outer surface of said non-conductive tapered core.

21. The assembly according to claim 19 , wherein said dielectric layer has a thickness of approximately 0.010 inches.

22. The assembly according to claim 21 , wherein the dielectric material is manufactured from a material selected from a group consisting of: a hydrocarbon ceramic loaded glass, ceramic, ceramic reinforced glass or PTFE-based materials, PTFE materials reinforced with glass fibers, hydrocarbon ceramic composites, and rigid plastic.

23. The assembly according to claim 21 , wherein said metal pad has a thickness of approximately 0.0007 inches.

24. The assembly according to claim 21 , wherein said metal pad has a surface area of approximately 0.003 square inches.

25. The assembly according to claim 21 , wherein said metal pad is manufactured from a material selected from a group consisting of copper, nickel, silver, gold and palladium.

26. The assembly according to claim 21 , wherein the assembly is configured to be coupled to a circuit board in an electrical circuit.

27. The assembly according to claim 26 , wherein said metal pad is configured to contact said proximate end of said conductive wire to generate a robust contact with a micro-strip line of the circuit board.

28. The assembly according to claim 2 , wherein a value of said damping resistor is in a range of 180 Ohms and higher.

29. The assembly according to claim 2 , wherein a value of said isolating resistor is in a range of from 0 Ohms to 100 Ohms.

30. The assembly according to claim 3 , wherein a value of said bypass capacitor is in a range of between 100 nF to over 220 nF.