Method of repairing a probe board

1. A method of repairing a probe board, the method comprising:

preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body;

inspecting an open defect in the first filling material of the plurality of first via electrodes;

removing the first filling material having the open defect from the first via electrodes;

filling a second filling material, having a lower sintering temperature than that of the first filling material, into a via hole of the first via electrodes from which the first filling material is removed; and

forming a second via electrode by sintering the second filling material.

2. The method of claim 1 , wherein the first filling material is copper or silver.

3. The method of claim 1 , wherein the second filling material is silver nano powder.

4. The method of claim 1 , wherein the second filling material is sintered at 400° C. or less.

5. The method of claim 1 , wherein the via hole for the open via electrode has a depth ranging from 1 mm to 4 mm.

6. The method of claim 1 , wherein the via hole for the open via electrode has a diameter ranging from 100 μm to 500 μm.

7. The method of claim 1 , wherein the via hole is formed by laser drilling or mechanical drilling.

8. The method of claim 1 , wherein the second filling material has a particle size ranging from 50 nm to 500 nm.