IP Library › Granted Patent US 8,809,478
Granted Patent B2
US 8,809,478 · App. 13/700,370 · Granted Aug 19, 2014

Silicon-containing curable composition, cured product of the silicon-containing curable composition and lead frame substrate formed of the silicon-containing curable composition

Inventors: Masako Saito (Tokyo, JP); Ichiro Hiratsuka (Tokyo, JP); Masahiro Wada (Tokyo, JP); Ryota Chiba (Tokyo, JP); Takuya Kanazawa (Tokyo, JP); Osamu Yoshioka (Tokyo, JP); Takehito Tsukamoto (Tokyo, JP); Junko Toda (Tokyo, JP)
Assignee: Adeka Corporation
C08L83/06C08K5/14C08K5/549H01L33/56H01L2224/48091C08L83/04H01L2224/45144H01L23/057H01L23/49861C08K5/5425C08K5/0025H01L2224/73265C08G77/20C08G77/12
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Quick Facts
Patent No.
US 8,809,478
App. No.
13/700,370
Granted
Aug 19, 2014
Kind
B2
Abstract

A curable composition includes: 100 parts by mass of a silicon-containing polymer having a Mw of 3,000 to 100,000 obtainable by hydrolysis-condensation of an organosilane mixture including R 1 SiX 3 , R 2 SiX 3 , R 3 R 4 SiX 2 and R 5 SiX 3 , the total of R 2 SiX 3 and R 3 R 4 SiX2 being 5 to 60 mol %, optionally a prepolymer, optionally a cyclic siloxane compound, 0.0001 to 10 parts by mass of an organic peroxide and optionally a metal catalyst, and 10 to 1,500 parts by mass of a filler, wherein R 1 is a C2-6 alkenyl group, R 2 is a C1-6 alkyl group, R 3 and R 4 are each a C1-6 alkyl group, R 5 is a phenyl group optionally substituted with a C1-6 alkyl group, and X is a C1-6 alkoxy group, one or more of R 2 to R 4 is a methyl group, f represents a number of 2 to 10, g represents a number of 0 to 8, and n represents 1 or 2.

Claims (29)

1. A silicon-containing curable composition comprising:

as component (A), 100 parts by mass of a silicon-containing polymer having a weight average molecular weight of 3,000 to 100,000, which is obtainable by hydrolysis-condensation of an organosilane mixture comprising 5 to 50 mol % of one or more kind of (a) an organosilane represented by the following formula (1-1), 0 to 50 mol % of one or more kind of (b) an organosilane represented by the following formula (I-2), 0 to 40 mol % of one or more kind of (c) an organosilane represented by the following formula (1-3) and 0 to 50 mol % of one or more kind of (d) an organosilane represented by the following formula (1-4), wherein the total of the organosilane (b) and organosilane (c) is 5 to 60 mol %;

as component (B), greater than 0 to 200 parts by mass of a prepolymer comprising two or more Si—H groups in one molecule, which is obtainable by a hydrosilylation reaction of one or more kind selected from (α) a cyclic siloxane mer compound represented by the following formula (2) and one or more kind selected from (β) a compound represented by the following formula (3) or (3′);

as component (C), 0 to 30 parts by mass of a cyclic siloxane compound comprising two or more carbon-carbon double bonds having reactivity with Si—H groups in one molecule;

as component (D), 0.0001 to 10 parts by mass of an organic peroxide and 0 to 1.0 parts by mass of a metal catalyst, and

as component (E), 10 to 1,500 parts by mass of a filler

R 1 SiX 3   (1-1)

R 2 SiX 3   (1-2)

R 3 R 4 SiX 2   (1-3)

R 5 SiX 3   (1-4)

wherein R 1 is an alkenyl group having 2 to 6 carbon atoms, R 2 is an alkyl group having 1 to 6 carbon atoms, and R 3 and R 4 are each independently an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms or a phenyl group optionally substituted by an alkyl group having 1 to 6 carbon atoms, wherein at least one of R 2 , R 3 ; and R 4 is a methyl group, R 5 is a phenyl group optionally substituted by an alkyl group having 1 to 6 carbon atoms, and X is a hydroxyl group, an alkoxy group having 1 to 6 carbon atoms or a halogen atom,

wherein in the formula (2), R 6 , R 7 and R 8 each independently represents an alkyl group having 1 to 6 carbon atoms or a phenyl group optionally substituted by an alkyl group having 1 to 6 carbon atoms, wherein R 6 s of a number of f may be the same or different and R 7 s of a number of g and R 8 s of a number of g each may also be the same or different, f represents a number of 2 to 10, g represents a number of 0 to 8, and f+g≧2,

wherein in the formula (3), n represents 1 or 2.

2. The silicon-containing curable composition according to claim 1 , wherein R 2 is a methyl group in the formula (1-2), and R 3 and R 4 are phenyl groups optionally substituted by an alkyl group having 1 to 6 carbon atoms in the formula (1-3).

3. The silicon-containing curable composition according to claim 1 , wherein R 2 is an alkyl group having 1 to 6 carbon atoms in the formula (1-2), and R 3 is an alkyl group having 1 to 6 carbon atoms and R 4 is a phenyl group optionally substituted by an alkyl group having 1 to 6 carbon atoms in the formula (1-3).

4. The silicon-containing curable composition according to claim 1 , wherein the content of the component (B) with respect to 100 parts by mass of the component (A) is 10 to 200 parts by mass.

5. The silicon-containing curable composition according to claim 1 , wherein the component (C) is a cyclic siloxane represented by the following formula (4)

wherein in the formula (4), R 9 , R 10 and R 11 each independently represents an alkyl group having 1 to 6 carbon atoms or a phenyl group optionally substituted by an alkyl group having 1 to 6 carbon atoms, wherein R 9 s of a number of p may be the same or different, and R 10 s of a number of q and R 11 s of a number of q may also be the same or different, p represents a number of 2 to 10, q represents a number of 0 to 8, and p+q≧2.

6. A cured product obtainable by curing the silicon-containing curable composition according to claim 1 .

7. A lead frame substrate for an LED light emitting device comprising a lead frame and a resin molded body, wherein the resin molded body is formed of the silicon-containing curable composition according to claim 1 .

8. An LED light emitting device apparatus using the lead frame substrate for an LED light emitting device according to claim 7 .

9. The silicon-containing curable composition according to claim 2 , wherein the content of the component (B) with respect to 100 parts by mass of the component (A) is 10 to 200 parts by mass.

10. The silicon-containing curable composition according to claim 3 , wherein the content of the component (B) with respect to 100 parts by mass of the component (A) is 10 to 200 parts by mass.

11. The silicon-containing curable composition according to claim 2 , wherein the component (C) is a cyclic siloxane represented by the following formula (4)

wherein in the formula (4), R 9 , R 10 and R 11 each independently represents an alkyl group having 1 to 6 carbon atoms or a phenyl group optionally substituted by an alkyl group having 1 to 6 carbon atoms, wherein R 9 s of a number of p may be the same or different, and R 10 s of a number of q and R 11 s of a number of q may also be the same or different, p represents a number of 2 to 10, q represents a number of 0 to 8, and p+q≧2.

12. The silicon-containing curable composition according to claim 3 , wherein the component (C) is a cyclic siloxane represented by the following formula (4)

wherein in the formula (4), R 9 , R 10 and R 11 each independently represents an alkyl group having 1 to 6 carbon atoms or a phenyl group optionally substituted by an alkyl group having 1 to 6 carbon atoms, wherein R 9 s of a number of p may be the same or different, and R 10 s of a number of q and R 11 s of a number of q may also be the same or different, p represents a number of 2 to 10, q represents a number of 0 to 8, and p+q≧2.

13. The silicon-containing curable composition according to claim 4 , wherein the component (C) is a cyclic siloxane represented by the following formula (4)

wherein in the formula (4), R 9 , R 10 and R 11 each independently represents an alkyl group having 1 to 6 carbon atoms or a phenyl group optionally substituted by an alkyl group having 1 to 6 carbon atoms, wherein R 9 s of a number of p may be the same or different, and R 10 s of a number of q and R 11 s of a number of q may also be the same or different, p represents a number of 2 to 10, q represents a number of 0 to 8, and p+q≧2.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 28, 2012
From: SAITO, MASAKO; HIRATSUKA, ICHIRO; WADA, MASAHIRO; CHIBA, RYOTA; KANAZAWA, TAKUYA; YOSHIOKA, OSAMU; TSUKAMOTO, TAKEHITO; TODA, JUNKO
To: ADEKA CORPORATION
Reel/Frame 029366/0857 →
Priority Claims (1)
JP 2010-133878 · Jun 11, 2010 · national
Continuity (1)
Related Publication 20130075154A1 · Mar 28, 2013