IP Library › Granted Patent US 8,816,245
Granted Patent B2
US 8,816,245 · App. 13/107,056 · Granted Aug 26, 2014

Method of cutting object to be processed

Inventors: Hiroyuki Iwaki (Hamamatsu, JP); Takafumi Ogiwara (Hamamatsu, JP); Takeshi Sakamoto (Hamamatsu, JP); Masaharu Hoshikawa (Hamamatsu, JP); Kazuhiro Atsumi (Hamamatsu, JP); Daisuke Kawaguchi (Hamamatsu, JP)
Assignee: Hamamatsu Photonics K.K.
B23K26/4075
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Quick Facts
Patent No.
US 8,816,245
App. No.
13/107,056
Granted
Aug 26, 2014
Kind
B2
Abstract

A method of cutting an object to be processed comprises the steps of irradiating an object to be processed with a laser light which is an elliptically-polarized light having an ellipticity other than 1 such that a direction of polarization of the laser light intersects a line to cut the object and a thickness direction of the object, while locating a converging point of the laser light within the object, so as to form a modified region within the object along the line and generate a fracture from the modified region in the thickness direction of the object, and causing the fracture to reach front and rear faces of the object so as to cut the object along the line.

Claims (10)

1. A method of cutting an object to be processed, comprising the steps of:

irradiating an object to be processed with a laser light which is an elliptically-polarized light having an ellipticity other than 1 such that a direction of polarization of the laser light intersects a line to cut the object and a thickness direction of the object, while locating a converging point of the laser light within the object, so as to form a modified region within the object along the line and simultaneously generate a fracture from the modified region in the thickness direction of the object; and

causing the fracture to reach front and rear faces of the object so as to cut the object along the line.

2. A method of cutting an object to be processed according to claim 1 , wherein a plurality of rows of modified regions are formed so as to align in the thickness direction of the object for one of the line.

3. A method of cutting an object to be processed according to claim 1 , wherein the object is irradiated with the laser light along the line such that the direction of polarization of the laser light is orthogonal to the line and the thickness direction of the object.

4. A method of cutting an object to be processed according to claim 2 , wherein the object is irradiated with the laser light along the line such that the direction of polarization of the laser light is orthogonal to the line and the thickness direction of the object.

5. A method of cutting an object to be processed according to claim 1 , wherein the elliptically-polarized light is a linearly-polarized light having an ellipticity of 0.

6. A method of cutting an object to be processed according to claim 2 , wherein the elliptically-polarized light is a linearly-polarized light having an ellipticity of 0.

7. A method of cutting an object to be processed according to claim 3 , wherein the elliptically-polarized light is a linearly-polarized light having an ellipticity of 0.

8. A method of cutting an object to be processed according to claim 4 , wherein the elliptically-polarized light is a linearly-polarized light having an ellipticity of 0.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 6, 2011
From: IWAKI, HIROYUKI; OGIWARA, TAKAFUMI; SAKAMOTO, TAKESHI; HOSHIKAWA, MASAHARU; ATSUMI, KAZUHIRO; KAWAGUCHI, DAISUKE
To: HAMAMATSU PHOTONICS K.K.
Reel/Frame 026859/0327 →
Priority Claims (1)
JP 2010-112188 · May 14, 2010 · national
Continuity (1)
Related Publication 20110309060A1 · Dec 22, 2011