Semiconductor device
View Patent ↗A semiconductor device includes: an electron transit layer formed on a substrate and of a group III nitride-based compound semiconductor; an electron supply layer formed on the electron transit layer and of a group III nitride-based compound semiconductor having a higher band gap energy than the transit layer; a field plate layer formed on the supply layer, formed of a non-p-type group III nitride-based compound semiconductor, and having a lower band gap energy than the supply layer; a first electrode forming an ohmic contact with a two-dimensional electron gas layer in the transit layer at an interface thereof with the supply layer; and a second electrode forming a Schottky contact with the electron gas layer. The second electrode forms an ohmic contact, at a side wall of the field plate layer, with two-dimensional hole gas in the field plate layer at an interface thereof with the supply layer.
1. A semiconductor device, comprising:
an electron transit layer that is formed on a substrate and formed of a group III nitride-based compound semiconductor;
an electron supply layer that is formed on the electron transit layer and formed of a group III nitride-based compound semiconductor having a higher band gap energy than the electron transit layer;
a field plate layer that is formed on the electron supply layer, is formed of a non-p-type group III nitride-based compound semiconductor, and has a lower band gap energy than the electron supply layer;
a first electrode that is formed so as to form an ohmic contact with a two-dimensional electron gas layer generated in the electron transit layer at an interface between the electron transit layer and the electron supply layer; and
a second electrode that is formed so as to form a Schottky contact with the two-dimensional electron gas layer, wherein
the second electrode forms an ohmic contact, at a side wall of the field plate layer, with two-dimensional hole gas generated in the field plate layer at an interface between the field plate layer and the electron supply layer.
2. The semiconductor device according to claim 1 , wherein the side wall of the field plate layer is tilted, with respect to a plane perpendicular to a surface of the electron supply layer, opposite to the second electrode.
3. The semiconductor device according to claim 1 , further comprising a recessed portion that is formed from the surface of the electron supply layer to a predetermined depth in the electron supply layer or the electron transit layer, wherein the second electrode is formed from inside of the recessed portion to the side wall of the field plate layer.
4. The semiconductor device according to claim 3 , wherein
the predetermined depth, from the surface of the electron supply layer, of the recessed portion is 10 nm or greater, and
a thickness of the electron transit layer directly under the recessed portion is 20 nm or greater.
5. The semiconductor device according to claim 1 , wherein the field plate layer has a region that is located at an electron supply layer side and has band gap energy that continuously or stepwisely decreases from the electron supply layer side to a side opposite to the electron supply layer.
6. The semiconductor device according to claim 5 , wherein a thickness of the region is 10 nm or greater.
7. The semiconductor device according to claim 1 , wherein the second electrode is formed on at least a part of a top surface of the field plate layer of the non-p-type.