Copper post solder bumps on substrates
A method comprises forming semiconductor flip chip interconnects having electrical connecting pads and electrically conductive posts terminating in distal ends operatively associated with the pads. We solder bump the distal ends by injection molding, mask the posts on the pads with a mask having a plurality of through hole reservoirs and align the reservoirs in the mask to be substantially concentric with the distal ends. Injecting liquid solder into the reservoirs and allowing it to cool provides solidified solder on the distal ends, which after mask removal produces a solder bumped substrate which we position on a wafer to leave a gap between the wafer and the substrate. The wafer has electrically conductive sites on the surface for soldering to the posts. Abutting the sites and the solder bumped posts followed by heating joins the wafer and substrate. The gap is optionally filled with a material comprising an underfill.
1. In a method comprising forming a semiconductor flip chip from a wafer having solderable electrical conducting sites and a substrate having electrical connecting pads and electrically conductive posts operatively associated with said pads and extending away from said pads to terminate in distal ends, the steps comprising
a. solder bumping said distal ends through openings in a solder mask by injection molding solder onto said distal ends to produce a solder bumped substrate and soldering said solder bumped substrate to said sites wherein said distal ends extend into said mask through said openings, including the steps comprising:
b. providing said substrate having said posts on said pads;
c. providing said mask wherein said openings comprise a plurality of through hole reservoirs and aligning said reservoirs in said mask to be substantially concentric with said distal ends;
d. injecting liquid solder into said reservoirs to provide a volume of liquid solder on said distal ends;
e. cooling said liquid solder in said reservoirs to solidify said solder;
f. removing said mask to expose said solidified solder after said cooling and thereby provide a solder bumped substrate;
g. positioning said solder bumped substrate on said wafer in a manner that leaves a gap between said wafer and said substrate;
h. abutting said posts and said sites and joining said wafer to said substrate by heating said solder to its liquidus temperature, wherein said posts comprise stud bumps.
2. In a method comprising forming a semiconductor flip chip from a wafer having solderable electrical conducting sites and a substrate having electrical connecting pads and electrically conductive posts operatively associated with said pads and extending away from said pads to terminate in distal ends, the steps comprising
a. solder bumping said distal ends through openings in a solder mask by injection molding solder onto said distal ends to produce a solder bumped substrate and soldering said solder bumped substrate to said sites wherein said distal ends extend into said mask through said openings, including the steps comprising:
b. providing said substrate having said posts on said pads;
c. providing said mask wherein said openings comprise a plurality of through hole reservoirs and aligning said reservoirs in said mask to be substantially concentric with said distal ends;
d. injecting liquid solder into said reservoirs to provide a volume of liquid solder on said distal ends;
e. cooling said liquid solder in said reservoirs to solidify said solder;
f. removing said mask to expose said solidified solder after said cooling and thereby provide a solder bumped substrate;
g. positioning said solder bumped substrate on said wafer in a manner that leaves a gap between said wafer and said substrate;
h. abutting said posts and said sites and joining said wafer to said substrate by heating said solder to its liquidus temperature;
wherein said posts are placed only on some of said pads and solder bumps placed on at least some of the other of said pads that do not have said posts in order to decrease any stress in said flip chip.
3. The method of claim 1 wherein said stud bumps comprise Cu, Au or Al stud bumps, mixtures thereof and alloys thereof.
4. The method of claim 2 wherein said conductive posts comprise stud bumps.
5. The method of claim 2 wherein said stud bumps comprise Cu, Au or Al stud bumps, mixtures thereof and alloys thereof.