Method of manufacturing rigid-flexible printed circuit board
The present invention relates to a method of manufacturing a rigid-flexible printed circuit board including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.
1. A method of manufacturing a rigid-flexible printed circuit board, which comprises:
providing a first flexible film having a first metal layer on one or both surfaces;
forming a first circuit pattern by patterning the first metal layer provided on the first flexible film; forming, on one or both surfaces of the first flexible film, a second flexible film that has a second metal layer on one surface thereof;
forming a second circuit pattern by patterning the second metal layer in a rigid domain R;
providing an anti-oxidation protective layer on the second metal layer in a flexible domain F such that a portion of the second metal layer is between the anti-oxidation protective layer and the first circuit pattern;
oxidizing the second circuit pattern to improve adhesion, excluding regions of the second circuit pattern covered by the anti-oxidation protective layer;
laminating circuit layers on the second flexible film; and
removing the circuit layer in the flexible domain F.
2. A method of manufacturing a rigid-flexible printed circuit board, which comprises:
providing a first flexible film having a first metal layer on one or both surfaces;
forming a first circuit pattern by patterning the first metal layer provided on the first flexible film;
forming, on one or both surfaces of the first flexible film, a second flexible film that has a second metal layer on one surface thereof;
forming a second circuit pattern by patterning the second metal layer in a rigid domain R;
providing an anti-oxidation protective layer on the second metal layer in a flexible domain F;
laminating circuit layers on the second flexible film; and
removing the circuit layer in the flexible domain F, wherein the anti-oxidation protective layer is removed in removing the circuit layer in the flexible domain F.
3. The method of manufacturing a rigid-flexible printed circuit board according to claim 1 , wherein the second metal layer corresponding to the flexible domain F is removed in removing the circuit layer in the flexible domain F.
4. The method of manufacturing a rigid-flexible printed circuit board according to claim 1 , further comprising:
attaching a bonding sheet between the second metal layer and the anti-oxidation protective layer.
5. The method of manufacturing a rigid-flexible printed circuit board according to claim 1 , wherein the anti-oxidation protective layer is made of an adhesive material including polyimide.
6. The method of manufacturing a rigid-flexible printed circuit board according to claim 1 , wherein providing the anti-oxidation protective layer on the second metal layer in the flexible domain F is performed by applying slurry, which is made of an adhesive material including polyimide, on the second metal layer corresponding to the flexible domain F;
and curing the slurry.
7. The method of manufacturing a rigid-flexible printed circuit board according to claim 1 , further comprising:
providing a bonding sheet between the first flexible film and the second flexible film.
8. The method of manufacturing a rigid-flexible printed circuit board according to claim 1 , wherein the circuit layer is formed by forming an insulating layer which covers the second circuit pattern under the circuit layer; forming a metal layer on the insulating layer; and forming a circuit pattern by patterning the metal layer.
9. The method of manufacturing a rigid-flexible printed circuit board according to claim 8 , wherein in forming the circuit pattern by patterning the metal layer, the metal layer in the flexible domain F is removed.
10. The method of manufacturing a rigid-flexible printed circuit board according to claim 1 , wherein removing the circuit layer in the flexible domain F is performed by a CO2 laser drilling process or a YAG laser drilling process.
11. The method of manufacturing a rigid-flexible printed circuit board according to claim 10 , wherein before the laser drilling process, a flexible domain F portion of the metal layer included in the uppermost circuit layer is removed.
12. A method of manufacturing a rigid-flexible printed circuit board, which comprises:
providing a flexible film having a metal layer on one or both surfaces;
forming a circuit pattern by patterning the metal layer;
forming a stopper metal layer on the metal layer in a flexible domain F;
providing an anti-oxidation protective layer on the stopper metal layer;
laminating at least one circuit layer on the flexible film; and
removing the circuit layer in the flexible domain F.
13. The method of manufacturing a rigid-flexible printed circuit board according to claim 12 , further comprising:
attaching a release film between the metal layer and the stopper metal layer.
14. The method of manufacturing a rigid-flexible printed circuit board according to claim 12 , wherein the anti-oxidation protective layer is removed in removing the circuit layer in the flexible domain F.
15. The method of manufacturing a rigid-flexible printed circuit board according to claim 12 , wherein the stopper metal layer is removed in removing the circuit layer in the flexible domain F.
16. The method of manufacturing a rigid-flexible printed circuit board according to claim 12 , further comprising:
attaching a bonding sheet between the stopper metal layer and the anti-oxidation protective layer.
17. The method of manufacturing a rigid-flexible printed circuit board according to claim 12 , wherein the anti-oxidation protective layer is made of an adhesive material including polyimide.
18. The method of manufacturing a rigid-flexible printed circuit board according to claim 12 , wherein providing the anti-oxidation protective layer on the stopper metal layer is performed by applying slurry, which is made of an adhesive material including polyimide, on the stopper metal layer; and curing the slurry.
19. The method of manufacturing a rigid-flexible printed circuit board according to claim 12 , wherein laminating the at least one circuit layer on the flexible film laminates the circuit layer after oxidizing the circuit pattern under the circuit layer.
20. The method of manufacturing a rigid-flexible printed circuit board according to claim 19 , wherein the circuit layer is formed by forming an insulating layer which covers the circuit pattern under the circuit layer; forming a metal layer on the insulating layer; and forming a circuit pattern by patterning the metal layer.
21. The method of manufacturing a rigid-flexible printed circuit board according to claim 20 , wherein in forming the circuit pattern by patterning the metal layer, the metal layer in the flexible domain F is removed.
22. The method of manufacturing a rigid-flexible printed circuit board according to claim 12 , wherein removing the circuit layer in the flexible domain F is performed by a CO2 laser drilling process or a YAG laser drilling process.
23. The method of manufacturing a rigid-flexible printed circuit board according to claim 22 , wherein before the laser drilling process, a flexible domain F portion of the metal layer included in the uppermost circuit layer is removed.