Chuck assembly for plasma processing
Systems and methods are presented for a peripheral RF feed and symmetric RF return for symmetric RF delivery. According to one embodiment, a chuck assembly for plasma processing is provided. The chuck assembly includes an electrostatic chuck having a substrate support surface on a first side, a facility plate coupled to the electrostatic chuck on a second side that is opposite the substrate support surface, a peripheral RF feed configured to deliver RF power, the peripheral RF feed having a first portion contacting a periphery of the facility plate and an RF strap coupling the peripheral RF feed to an RF source.
1. A chuck assembly for plasma processing, comprising:
an electrostatic chuck having a substrate support surface on a first side;
a facility plate coupled to the electrostatic chuck on a second side that is opposite the substrate support surface;
a plurality of facility components coupled to the facility plate, the plurality of facility components including at least one of a group consisting of a heating component, a cooling component, a lift pin system component, a gas distribution component, at least one vacuum port, an instrumentation probe and/or an electrostatic clamping component;
a peripheral RF feed configured to deliver RF power, the peripheral RF feed having a first portion contacting a substantial entirety of a periphery of the facility plate, the facility plate coupling the RF power from the peripheral RF feed to the electrostatic chuck; and
an RF strap coupling the peripheral RF feed to an RF source.
2. The chuck assembly of claim 1 , wherein the plurality of facilities components coupled to the facility plate are enclosed within the first portion of the peripheral RF feed.
3. The chuck assembly of claim 1 , wherein the first portion of the peripheral RF feed a sidewall assembly, the sidewall assembly extending substantially perpendicular from the facility plate.
4. The chuck assembly of claim 3 , further comprising a second portion of the peripheral RF feed including an input plate, wherein the input plate is oriented substantially parallel to the facility plate and coupled to the first portion along a periphery of the input plate, the sidewall assembly electrically coupling the input plate and the facility plate.
5. The chuck assembly of claim 4 , further comprising a mounting flange disposed substantially centrally in the input plate and wherein the RF strap is coupled to the mounting flange.
6. The chuck assembly of claim 3 , wherein the sidewall assembly includes at least one opening and further comprising a cooling system supply facilities connection passing through the least one opening to the facility plate.
7. The chuck assembly of claim 1 , further comprising a conducting component coupled to the facility plate and defined within an interior of the first portion of the hollow RF feed.
8. The chuck assembly of claim 1 , further comprising a symmetrical, grounded shield substantially surrounding the peripheral RF feed.
9. The chuck assembly of claim 1 , wherein the first portion of the hollow RF feed contacts the entire the periphery of the facility plate at a circumference defined on a side of the facility plate opposite the electrostatic chuck.
10. The chuck assembly of claim 9 , wherein the circumference having a radius greater than one-half of a radius of the facility plate.
11. The chuck assembly of claim 1 , wherein the first portion of the peripheral RF feed includes at least one opening for at least one facilities connection to the facility plate.
12. The chuck assembly of claim 1 , wherein the plurality of facility components further includes a non-conductive lift pin system.
13. The chuck assembly of claim 1 , wherein the plurality of facility components further includes a lift pin system that is electrically isolated from the hollow RF feed and the RF strap.
14. A chuck assembly for plasma processing, comprising:
an electrostatic chuck having a substrate support surface on a first side;
a facility plate coupled to the electrostatic chuck on a second side that is opposite the substrate support surface;
a plurality of facility components coupled to the facility plate, the plurality of facility components including at least one of a group consisting of a heating component, a cooling component, a lift pin system component, a gas distribution component, at least one vacuum port, an instrumentation probe and/or an electrostatic clamping component;
a peripheral RF feed configured to deliver RF power, the peripheral RF feed having a first portion contacting a substantial entirety of a periphery of the facility plate wherein the first portion of the hollow RF feed contacts the periphery of the facility plate at a circumference defined on a side of the facility plate opposite the electrostatic chuck wherein the first portion of the peripheral RF feed includes at least one opening for at least one facilities connection to the facility plate, the facility plate coupling the RF power from the peripheral RF feed to the electrostatic chuck;
an RF strap coupling the peripheral RF feed to an RF source; and
a substantially symmetrical, grounded shield surrounding the peripheral RF feed.
15. The chuck assembly of claim 14 , wherein the plurality of facility components further includes a lift pin system that is electrically isolated from the hollow RF feed and the RF strap.
16. The chuck assembly of claim 14 , wherein the first portion of the hollow RF feed contacts the entire periphery of the facility plate at a circumference defined on a side of the facility plate opposite the electrostatic chuck.