Method for improving resist pattern peeling
A method of fabricating a mask is described. The method includes receiving receiving an integrated circuit (IC) design layout that has a first pattern layer including a first feature and has a second pattern layer including a second feature, wherein the first pattern layer and the second pattern layer are spatially related when formed in a substrate such that the first and second features are spaced a first distance between a first edge of the first feature and a second edge of the second feature, modifying the IC design layout by adjusting a dimension of the first feature based on the first distance, and generating a tape-out data from the modified IC design layout for mask making. The method further includes applying a logic operation (LOP) to the IC design layout.
1. A method of forming a resist pattern, the method comprising:
receiving a substrate having a material feature embedded in the substrate;
depositing a resist film on the substrate and the material feature; and
exposing the resist film according to a design pattern having a first feature to form the resist pattern overlaying the material feature on the substrate, wherein the first feature and the material feature are spaced a first distance between a first edge of the first feature and a second edge of the material feature in a top view, wherein the first feature has a dimension that is a function of the first distance;
wherein the dimension of the first feature is increased by a first value when the first distance is larger than a first predetermined value.
2. The method of claim 1 , further comprising developing the exposed resist film deposited on the substrate.
3. The method of claim 1 , wherein the exposing the resist film includes applying one of a light beam, an electron beam and an ion beam.
4. The method of claim 3 , wherein the applying of the optical beam includes using a mask.
5. The method of claim 1 , wherein the first value is zero when the dimension of the first feature is larger than a second predetermined value.
6. The method of claim 5 , wherein the first value is zero when the a second distance between the first feature and an adjacent feature is smaller than a second predetermined value.
7. A method of forming a resist pattern, the method comprising:
receiving a substrate having a material feature buried in the substrate;
depositing a resist film on the substrate and the material feature; and
exposing the resist film according to a mask having a first feature to form the resist pattern overlaying the material feature on the substrate, wherein
the first feature and the material feature are spatially related;
the first feature and the substrate pattern are spaced a first distance between a first edge of the resist pattern and a second edge of the material feature; and
a dimension of first feature is a function of the first distance;
wherein the dimension of the first feature is adjusted by adding a value when the first distance is larger than a first predetermined value.
8. The method of claim 7 , further comprising developing the exposed resist film deposited on the substrate.
9. The method of claim 7 , wherein the value is a function of the first predetermined value.
10. The method of claim 7 , wherein the value is zero when the dimension of first feature is larger than a second predetermined value.
11. The method of claim 7 , wherein the value is zero when a second distance between two adjacent resist patterns is smaller than a second predetermined value.
12. A method, comprising:
receiving a substrate having a material feature embedded in the substrate;
forming a resist pattern overlaying the material feature on the substrate,
wherein the resist pattern includes a first feature,
wherein the first feature and the material feature are spaced a first distance between a first edge of the first feature and a second edge of the material feature in a top view, and
wherein the first feature has a dimension that is a function of the first distance;
wherein the dimension of the first feature is increased by a first value when the first distance is larger than a first predetermined value.
13. The method of claim 12 , wherein forming the resist pattern includes exposing a resist film by applying one of a light beam, an electron beam and an ion beam.
14. The method of claim 13 , further comprising developing the exposed resist film deposited on the substrate.
15. The method of claim 13 , wherein the applying of the optical beam includes using a mask.
16. The method of claim 12 , wherein the first value is zero when the dimension of the first feature is larger than a second predetermined value.
17. The method of claim 16 , wherein the first value is zero when the a second distance between the first feature and an adjacent feature is smaller than a second predetermined value.