Die up fully molded fan-out wafer level packaging

1. A method of making a semiconductor package, comprising:

placing a plurality of die units face up on a carrier, each die unit having an active front surface comprising at least one bond pad oriented away from the carrier and a back surface opposing the active front surface, the active front surface and the back surface joined by at least four side surfaces;

forming a plurality of conductive interconnects, each conductive interconnect coupled to the at least one bond pad of one of the plurality of die units;

encapsulating the plurality of die units and the plurality of conductive interconnects with an encapsulant that covers the active front surface and the at least four side surfaces of each of the plurality of die units;

exposing a first surface of each of the plurality of conductive interconnects by removal of a portion of the encapsulant; and

forming a redistribution layer (RDL) disposed over, and in direct contact with, the encapsulant.

2. The method of making the semiconductor package of claim 1 , further comprising encapsulating the plurality of die units and the plurality of conductive interconnects in a single step.

3. The method of making the semiconductor package of claim 1 , further comprising exposing the first surface of each of the plurality of conductive interconnects, wherein exposing the first surface of each of the plurality of interconnects comprises leaving at least a portion of the encapsulant disposed over the active front surface of each of the plurality of die units.

4. The method of making the semiconductor package of claim 1 , further comprising forming the encapsulant as a polymer layer or dielectric film positioned between the plurality of die units and the carrier, the polymer layer or dielectric film being permanently attached to the plurality of die units.

5. The method of making the semiconductor package of claim 1 , further comprising disposing a dielectric film over the back surface of the plurality of die units comprising a thickness between a ratio of 5:1 and 1:5 compared with a thickness of the encapsulant covering the active front surface.

6. The method of making the semiconductor package of claim 1 , further comprising encapsulating the plurality of die units with a compression molding process or lamination process.

7. The method of making the semiconductor package of claim 1 , further comprising forming the plurality of conductive interconnects as plated posts.

8. The method of making the semiconductor package of claim 1 , further comprising coupling the plurality of conductive interconnects to fan-in redistribution layers disposed between each of the plurality of die units and the conductive interconnects.

9. A method of making a semiconductor package, comprising:

providing a first die unit comprising an active front surface comprising a bond pad that is opposite a back surface, the active front surface and the back surface joined by at least four side surfaces;

forming a fan-in redistribution layer (RDL) over the active front surface and coupled to the bond pad;

forming a conductive interconnect coupled to the fan-in RDL and the bond pad of the active front surface;

disposing the first die unit over a carrier with the active front surface oriented away from the carrier; and

encapsulating the first die unit and the conductive interconnect with an encapsulant that covers the active front surface and the at least four side surfaces of the first die unit.

10. The method of making the semiconductor package of claim 9 , further comprising encapsulating the first die unit and the conductive interconnect with the encapsulant in a single step.

11. The method of making the semiconductor package of claim 9 , further comprising exposing the conductive interconnect through removing a portion of the encapsulant.

12. The method of making the semiconductor package of claim 9 , further comprising encapsulating the first die unit and the conductive interconnect before removing the carrier.

13. The method of making the semiconductor package of claim 9 , wherein the conductive interconnect has a height of at least about 20 microns.

14. The method of making the semiconductor package of claim 9 , further comprising forming a second redistribution layer in direct contact with the encapsulant and disposed over the first die unit.

15. The method of making the semiconductor package of claim 9 , further including forming the conductive interconnect as a copper post plated over the active front surface of the first die unit.

16. The method of making the semiconductor package of claim 9 , further comprising a second die unit disposed within the semiconductor package.

17. A semiconductor package comprising:

a first die unit having an active surface comprising a plurality of bond pads and a back surface opposing the active surface, the active surface and back surface joined by at least four side surfaces;

a plurality of conductive posts coupled to the plurality of die bond pads;

a first encapsulant that covers the active surface, the plurality of conductive posts, and the at least four side surfaces of the first die unit; and

a first redistribution layer coupled to ends of the plurality of conductive posts.

18. The semiconductor package of claim 17 , further comprising a second encapsulant disposed over the back surface of the first die unit, wherein the second encapsulant comprises a footprint that is substantially equal to a footprint of the first die unit and further comprises a surface that is coplanar with a surface of the first encapsulant.

19. The semiconductor package of claim 18 , wherein the first redistribution layer is a fan-out redistribution layer formed over the first encapsulant.

20. The semiconductor package of claim 19 , further comprising a second redistribution layer formed over the active surface of the first die unit, wherein the conductive posts are plated over the second redistribution layer.

21. The semiconductor package of claim 18 , wherein the conductive posts are plated over the plurality of die bond pads on the active surface of the first die unit.

22. The semiconductor package of claim 18 , further including a polymer layer or dielectric film disposed over the active surface.

23. The semiconductor package of claim 22 , wherein the first redistribution layer is a fan-in redistribution layer formed over the polymer layer or dielectric film.

24. The semiconductor package of claim 18 , further comprising a second die unit disposed within the semiconductor package.

25. The semiconductor package of claim 24 , wherein a thickness of the first encapsulant covering the active surface has a ratio of between approximately ⅕ and 5 in relation to a thickness of the second encapsulant covering the back surface.

26. The semiconductor package of claim 18 , wherein the conductive posts have a height of at least about 20 microns.

27. The semiconductor package of claim 18 , wherein the first encapsulant or the second encapsulant comprise an epoxy film.

28. The semiconductor package of claim 23 , further comprising a second redistribution layer formed as a fan-out redistribution layer.